Packaging

TSMC Awarded $6.6B in CHIPS and Science Act Funding for Investments in Arizona Fabs

TSMC announces 2nm technology at second fab and a new third fab to produce 2nm or more advanced chips.

Microchip Technology Expands Partnership with TSMC

Microchip Technology announced it has expanded its partnership with TSMC, to enable a specialized 40nm manufacturing capacity at Japan Advanced Semiconductor Manufacturing, Inc. (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan.

$6.6 Billion in Subsidies to TSMC Won’t Fix Deep Market Structure Issues In Semiconductor Industry

In response to news that the Biden administration has directed $6.6 billion in subsidies to Taiwan Semiconductor Manufacturing Co’s (TSMC) Arizona subsidiary, as part of the U.S. CHIPS and Science Act, the American Economic Liberties Project released the following statement. 

U.S. Department of Commerce Receives Over 160 Concept Plans for CHIPS for America Funding

Projects to play vital role in strengthening the U.S. semiconductor supply chain.

Global Semiconductor Sales Increase 16.3% Year-to-Year in February

Year-to-year market growth in February is largest since May 2022; worldwide chip sales decrease 3.1% month-to-month.

sureCore Announces Low Power Memory Compiler for 16nm FinFET

sureCore, the low power embedded memory specialist, has announced the availability of its PowerMiser, ultra-low, dynamic power memory compiler in 16nm.

Semiconductor Metal Plating Chemicals to Top $1 Billion

TECHCET is forecasting Metal Plating Chemicals to grow 7% in 2024, to reach over $1 billion.

Binghamton University Receives $1M to Support Job Training in Electronics Manufacturing

New cleanroom equipment creates ideal space for students to learn advanced packaging processes.

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

SK hynix Inc. announced today that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.

Nordson Electronics Solutions Expands the SELECT Synchro Selective Soldering Equipment Family

Nordson Electronics Solutions releases the Synchro 3, a new model in the SELECT Synchro selective soldering equipmen family for high-volume printed circuit board assembly applications.

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