A research team led by materials scientists from City University of Hong Kong (CityUHK) recently discovered a new strategy for developing highly versatile electronics with outstanding performance, using transistors made of mixed-dimensional nanowires and nanoflakes.
Packaging
Intrinsic ID Joins Intel Foundry Accelerator IP Alliance to Secure Leading-Edge Semiconductors
Intrinsic ID, the provider of Physical Unclonable Function (PUF) technology field-proven in more than 650 million devices across the globe, today announced that it is now a member of the Intel Foundry Accelerator IP Alliance program to ensure the availability of hardware-based root-of-trust (RoT) solutions for Intel Foundry customers.
Fujitsu Collaborates With QuTech
Fujitsu today announced a collaboration with QuTech for the development of the world’s first cryogenic electronic circuits for controlling diamond-based quantum bits.
IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC
Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.
Ideal Power Successfully Completes Phase II of Development Program with Stellantis
Ideal Power Inc. today announced the successful completion of Phase II deliverables of a product development agreement with Stellantis, a top 10 global automaker.
ASIP’s OSAT/ATMP Project Launched With Korean JV
Hyderabad based ASIP (Advanced System in Package Technologies) has announced the launch of its project with Korean company APACT Limited as a Joint Venture
Cadence and Intel Foundry Collaborate to Enable Heterogeneous Integration with EMIB Packaging Technology
Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures.
Aerotech Invests in Korean Manufacturing Facility
Aerotech Inc., a global leader in precision motion control and automation, is expanding its partnership with Korean distributor ANI Motion Tech.
TECHCET Welcomes Mike Walden as New Senior Director
TECHCET announced Mike (Michel) Walden as the new Senior Director of Market Research and Analytics for TECHCET.
SIA Commends CHIPS Act Incentives for GlobalFoundries Projects
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced by the U.S. Department of Commerce and GlobalFoundries.
