Tape out confirms most efficient and flexible UCIe-, BoW-, and UMI-compatible multi-die solution for standard or advanced packaging implementations.
Packaging
SEMI and UCLA Offer Guide to Facilitate Onshoring Advanced Packaging Facilities in the United States
SEMI today announced the availability of a free quick start guide to facilitate the onshoring of advanced packaging facilities in the United States and support the region’s buildout of a semiconductor manufacturing supply chain.
Solvay Advances STEM Education with MIT and Fermi High School Through Scholarship Initiative
The scholarship award ceremony included a tour of Rosignano’s factory, showcasing Solvay’s commitment to safety and sustainability, bridging academia with industry challenges.
Global Semiconductor Sales Decrease 8.2% in 2023; Market Rebounds Late in Year
The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales totaled $48.0 billion during the month of November 2023, an increase of 5.3% compared to the November 2022 total of $45.6 billion and 2.9% more than the October 2023 total of $46.6 billion.
Phil Kaufman Award Ceremony and Banquet Set for February 22
The Phil Kaufman Award ceremony and banquet honoring Dr. Lawrence Pileggi of Carnegie Mellon University (CMU) as the 2023 award recipient will be held Thursday, February 22, 6:30-9:30pm at The GlassHouse in San Jose, Calif.
Netsol Drives Automotive Innovation With Flash-Like MRAM Breakthrough
Memory innovator Netsol has announced a major leap in the memory technology with the development of a Flash-like MRAM.
Heraeus Electronics Acquires PriElex Electronic Inks from Kayaku Advanced Materials
Heraeus Electronics, a provider of advanced materials solutions, announced the successful acquisition of the PriElex electronics inks business line from Kayaku Advanced Materials Inc.
Pfeiffer Vacuum and GSI/FAIR Honor Dr. Simon Lauber with FAIR-GSI PhD Award
Dr. Simon Lauber was honored with the “FAIR-GSI PhD Award 2023” for his outstanding dissertation.
How Does Light Propagate in Integrated Circuits on Chips?
Researchers at the Technion are answering this question and paving the way to new applications in communication, imaging, and quantum computing.
MIT, Applied Materials and the Northeast Microelectronics Coalition Hub to Bring 200mm Advanced Research Capabilities to MIT.nano
Toolset will bridge academic innovations and industry pathways to scale for semiconductors, microelectronics and other critical technologies.
