The company seeks to support and leverage growing semiconductor and advanced packaging ecosystem in the region
Packaging
SEMI Applauds Announcement of European Economic Security Strategy
SEMI said the move as a positive and fundamental step forward in assuring Europe’s economic security. The strategy was initially announced in June 2023 in response to the pandemic and the rise in geopolitical tensions.
DoD Awards $49M for Advanced Semiconductor Packaging
The Department of Defense announced the award of two contracts totaling $49 million to revitalize advanced packaging capabilities and capacity for semiconductors used in defense applications.
Moov Releases Equipment Management Software for Semiconductor Manufacturers
Moov released its new Equipment Management Software (EMS) for semiconductor manufacturers, which helps manufacturers track and understand what equipment assets they own.
Protec MEMS Technology Orders Maskless Lithography System from EVG
The LITHOSCALE system will be installed at PMT’s headquarters in Asan-si, Chungcheongnam-Do, South Korea, where it will be used in the production of next-generation MEMS-based probe cards for wafer-level testing of advanced NAND, DRAM and High Bandwidth Memory (HBM) devices.
NHanced Opens Advanced Package Assembly Facility in IN
NHanced Semiconductors is a US-based pure-play advanced packaging foundry specializing in leading-edge technologies. NHanced president Robert Patti was joined by U.S. Senator Todd Young (R-IN); Andrea Richter-Garry, senior VP of the Indiana Economic Development Corporation (IEDC), representing Indiana Governor Eric Holcomb; and Dr. Kyle Werner, NSWC Crane Deputy Technical Director, at the ribbon-cutting ceremony for its NHanced WestGate Facility, a multimillion-dollar advanced package assembly center, on January 19. This represents…
Deirdre Hanford Appointed as CEO Of Natcast
Natcast announced the appointment of Deirdre Hanford as its founding Chief Executive Officer. The selection of Hanford will enable Natcast to begin operations in earnest in 2024.
Demand for AI-Optimized Chipsets to Spur Requirements for Hybrid Bonding
Compared with other methods, hybrid bonding offers inherent advantages in high-density IO (input- output), reduced parasitic delay, shorter height and improved thermal performance.
Global Semiconductor Sales Increase 5.3% Year-to-Year in November
November marks first month of year-to-year market growth in over a year; worldwide chip sales increase 2.9% month-to-month.
Governor Ron DeSantis Announces More than $35 Million to Accelerate the Growth of Florida’s Semiconductor Industry
This week, Governor Ron DeSantis announced that more than $35 million in funding from the Workforce Development Capitalization Incentive Grant Program will be allocated to Florida school districts and Florida College System institutions to create or expand semiconductor-related instructional programs for students.
