The National Institute of Standards and Technology — part of the U.S. Department of Commerce — announced today that it plans to award as much as $100 million to Arizona State University and Deca Technologies for the SHIELD USA initiative.
Packaging
CHIPS for America Announces up to $300M in Funding to Boost U.S. Semiconductor Packaging
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs
Renesas Electronics Corporation today announced that it has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).
indie Semiconductor Extends Automotive Photonics Leadership With Advanced Optical Component Integration Capabilities
indie Semiconductor has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.
Natcast CEO Deirdre Hanford to Deliver Keynote Remarks at 2024 SIA Awards Dinner
Natcast is the non-profit entity operating the National Semiconductor Technology Center (NSTC), established by the CHIPS and Science Act.
C-Hawk Technology Pioneers Robotic Plastic Welding with New Roberto Platform for Semiconductor Equipment Manufacturing
C-Hawk Technology announced its new patent-pending Roberto platform, an integrated robotics system that automates plastic welding and sets new benchmarks for quality, precision, scalability and safety in manufacturing for plastic welded assemblies and subassemblies.
Applied Materials Announces New Collaboration Model for Advanced Packaging at Summit on Energy-Efficient Computing
Company convenes top semiconductor R&D leaders to advance high-performance, low-power AI chip packaging technologies.
CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins
The Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Department to provide SRC $285 million to establish and operate a Manufacturing USA institute headquartered in Durham, North Carolina.
JEDEC Announces Enhanced NAND Flash Interface Standard With Increased Speeds and Efficiency
JEDEC Solid State Technology Association today announced the publication of JESD230G: NAND Flash Interface Interoperability Standard.
FormFactor Receives SK hynix Best Partner Award
FormFactor, Inc., a supplier of electrical test and measurement solutions for the semiconductor industry, announced today that it has been recognized as an outstanding partner by SK hynix, a global leader in DRAM and Flash memory manufacturing.
