MTR Carbon Capture has been contracted by Taiwan Semiconductor Manufacturing Company (TSMC) to supply a Polaris membrane carbon capture system to treat emissions from a TSMC solvent incineration facility in Taiwan.
Packaging
SPIE and Boston University Announce $1 Million Endowment for Graduate and Postgraduate Scholarships
SPIE, the international society for optics and photonics, and Boston University (BU) announced the establishment of the SPIE-Boston University Scholarship in Photonics during SPIE Photonics West in San Francisco.
TANAKA Develops AgSn TLP Sheet, A Bonding Material for Power Semiconductors
Compatible with large chip sizes of 20mm, enabling highly reliable bonding over extensive areas and contributes to growing demand for high-current power semiconductors in electric vehicles, hybrid automobiles, industrial infrastructure, etc.
Amtech Appoints New Member to Board of Directors
Amtech Systems, Inc., a manufacturer of equipment and consumables for semiconductor fabrication and packaging, today announced the appointment of Asif Y. Jakwani to its Board of Directors.
Numem Overcomes AI Performance Barriers with Next-Gen Memory Solutions, Highlights Innovations at Chiplet Summit
Numem will be at the upcoming Chiplet Summit to showcase its high-performance solutions. By accelerating the delivery of data via new memory subsystem designs, Numem solutions are re-architecting the hierarchy of AI memory tiers to eliminate the bottlenecks that negatively impact power and performance.
Singular Photonics Emerges from Stealth with Portfolio of SPAD-based Image Sensors
Singular Photonics emerged from stealth mode today, launching a new generation of image sensors based on single photon avalanche diodes (SPADs).
New Optical Memory Unit Poised to Improve Processing Speed and Efficiency
Fast, versatile volatile photonic memory could enhance AI, sensing and other computationally intense applications.
MACOM Signs Preliminary Memorandum of Terms for Federal CHIPS and Science Act Funding
Today, the Healey-Driscoll administration celebrated MACOM Technology Solutions Inc. (MACOM), the Lowell-based manufacturer that develops and supplies semiconductor components to the commercial and defense sectors, signing a preliminary memorandum of terms with the federal government for funding under the CHIPS for America program.
Boosting AI Model Size and Training Speed with Lightwave-Connected Chips
AI growth is capped by data transfer rates between computing chips, but transferring data with light could remove the ceiling.
ASU Selected as Home and Partner for CHIPS and Science Act-Funded National Lab for Semiconductor Advanced Packaging
Following a week where a spirited effort by the Sun Devil football team captured the nation’s attention in the Peach Bowl, it is Arizona State University’s capability as a top-tier research university that has delivered ASU a momentous national win to kick off 2025.
