Packaging

James Culp of GlobalFoundries Joins Si2 Board

The Silicon Integration Initiative has announced the addition of James Culp, a GlobalFoundries corporate fellow, to its board of directors.

Biden-Harris Administration Announces NY CREATES’ Albany NanoTech Complex as the First CHIPS for America R&D Flagship Facility

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility.

ULVAC Launches Technology Center PYEONGTAEK for Next-Gen Semiconductor Manufacturing Equipment in South Korea

ULVAC, Inc. has established Technology Center PYEONGTAEK in Pyeongtaek, Gyeonggi-do, South Korea.

ESCATEC Pushes New Boundaries in Micro-Electronics with UV Enhanced Die Bonder Technology

Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.

Pfeiffer Vacuum+Fab Solutions Presents the New Generation of Rotary Vane Vacuum Pumps

Pfeiffer Vacuum+Fab Solutions introduces DuoVane, a new series of rotary vane vacuum pumps. Usable worldwide, reliable and efficient, they are the optimized successors to the proven pumps from the Pascal and DuoLine series.

Magnachip Expands Production of 7th Generation MXT LV MOSFETs

Magnachip Semiconductor Corporation announced today the expansion of production for its 7th generation 1)MXT LV MOSFETs, which are based on Magnachip’s Super Short Channel FET technology.

Critical Manufacturing Brings Highly Advanced Semiconductor MES Solution to SEMICON Europa

Critical Manufacturing is returning to SEMICON Europa 2024 to showcase its advanced Manufacturing Execution System (MES), tailored to the unique needs of the semiconductor industry.

US CHIPS Act Set to Reshape Helium Demand in the US

Two years after signing the US Chips Act into law for onshore chip manufacturing, over US$30 billion of the total US$39 billion in direct incentives have been awarded to date.

Sunlit Chemical Expands Global Reach with U.S. Facility Opening in Phoenix

The new plant, strategically located in Phoenix, Ariz., will provide critical materials to support the U.S. semiconductor industry.

Top MRAM Maker Selects ClassOne Solstice S8 Single-Wafer System for High-Volume Manufacture of Non-Volatile MRAM Devices

The customer selected the Solstice system for its ability to deliver repeatable wet processing essential to meeting high-volume manufacturing (HVM) requirements.

Featured Products