Three groups are vying to lead Chips Manufacturing USA institute focused on digital twins.
Packaging
A Novel New Approach to Acoustic Inspection using SpinSAM Technology
A look at how some of the latest acoustic inspection technology developments and the continued use of AI are addressing the exacting quality control needs of manufacturers.
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
Approximate $7 billion investment over the next several years to meet AI data center demand.
CEA-Leti Will Unveil Major R&D Gains At Photonics West
CEA-Leti will present six papers at Photonics West, including an invited one, detailing its recent breakthroughs and major results for the future of photonics-based applications Jan. 25-30 in San Francisco.
FormFactor Expands Partnership with Advantest
Partnership builds on a multi-year collaboration to accelerate industry innovation in enabling advanced packaging and high-performance-compute.
Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
Eighteen New Semiconductor Fabs to Start Construction in 2025
The semiconductor industry is expected to start 18 new fab construction projects in 2025. The new projects include three 200mm and fifteen 300mm facilities, the majority of which are expected to begin operations from 2026 to 2027.
Applying Visual Data Science and AI to Solve Complex Manufacturing Challenges
Spotfire’s immersive analytics experience aligns with natural human interactions, offering features like AI-powered recommendations, real-time data integration, and intuitive visual manipulation.
2025: A Blend of Challenges and Opportunities
The semiconductor industry remains a dynamic landscape, propelled by technical advancements and shifting market demands.
Marvell Announces Breakthrough Co-Packaged Optics Architecture for Custom AI Accelerators
Marvell Technology, Inc. today announced the advancement of its custom XPU architecture with co-packaged optics (CPO) technology.
