SK hynix Inc. announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time in the world.
Packaging
Thermo Fisher Scientific Introduces the Vulcan Automated Lab to Transform Semiconductor Analysis
Thermo Fisher Scientific Inc. today announced the launch of the Thermo Scientific Vulcan Automated Lab, a groundbreaking solution designed to drive a new era of process development and control in semiconductor manufacturing.
Laser Heating Enabling Sustainable Semiconductor Manufacturing
Laser heaters show promise to impact sustainability in numerous ways, ranging from increased tool efficiency, shorter process cycle time, and lower maintenance and consumables burdens associated with thermal processing, all of which lighten the impact of a process on fab infrastructure.
Multiple Vectors Tackle Memory Bandwidth
Hybrid bonding and new memories are enabling bandwidth gains.
onsemi Launches Silicon Carbide-Based Intelligent Power Modules
Today, onsemi introduced the first generation of its 1200V silicon carbide (SiC) metal oxide semiconductor field-effect transistor (MOSFET) based SPM 31 intelligent power modules (IPMs).
New from PI: Advancing Sustainable, Lead-Free Piezoelectric Ceramics
PI Ceramic and Ultrasonic Advisors are hosting an exclusive webinar on the latest advancements in sustainable, lead-free piezoelectric ceramics for medical and industrial sensing and actuation applications.
NoMIS Power Achieves Major Breakthrough in SiC Short-Circuit Withstand Time
NoMIS Power, a leader in advanced silicon carbide (SiC) power semiconductor technology, has announced a major breakthrough in improving the short-circuit withstand time (SCWT) of SiC MOSFETs.
TransPak’s Global Growth Continues with Expansion in Wales
The 44,000-square-foot TransPak Wales facility strategically positions the company to support the growing needs of its customers in Europe, particularly within the semiconductor and data server industries.
Global Technologies Makes Acquisition in France
Mycronic’s Global Technologies division has acquired Hprobe, a company headquartered in Grenoble, France, which has developed a unique technology for high-speed magnetic testing of Magnetoresistive Random Access Memories (MRAMs) and magnetic sensors.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
