Technology for 5G & 6G infrastructure, satcom, radar for UAV detection and other applications uses existing cleanrooms with larger substrates.
Packaging
Imec’s Extremely Scaled SOT-MRAM Devices Show Record Low Switching Energy and Virtually Unlimited Endurance
Scaling the spin-orbit transfer (SOT) track as a critical step towards SOT-MRAM for cache memory applications.
CEA-Leti Reports Breakthrough 3D Sequential Integration (3DSI) Of CMOS Over CMOS with Advanced Metal Lines
Achievement establishes the feasibility of manufacturing high-performance silicon CMOS devices above an industrial platform, including state-of-the-art BEOL, without compromising the performance of the bottom layer.
The A+ Team Tackles AI and Quantum Computing Hardware
Jefferson Lab leads a multidisciplinary team selected by DOE to advance a superconducting approach to advanced computer chip technology.
Supplyframe and Jabil Announce Partnership
Supplyframe have announced a collaboration to transform the electronics industry, leveraging artificial intelligence and automation for enhanced operations and decision-making.
SEMI Honors Semiconductor Industry Sustainability Leaders
SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced recipients of the 2023 SEMI Sustainability Excellence Award.
Breakthrough Digital Lithography Technology from Applied Materials and Ushio To Enable More Powerful Computing Systems for the AI Era
Strategic partnership to accelerate industry’s transition to heterogeneous chiplet integration on glass and other large substrates.
SEMICON Japan 2023 Opens Tomorrow to Showcase Smart Data-AI, Smart Mobility, Sustainability, Advanced Packaging, Talent
SEMICON Japan, the largest and most influential gathering of the microelectronics manufacturing supply chain in Japan, opens tomorrow at Tokyo Big Sight with more than 900 exhibitors from 19 regions showcasing their latest products and technologies.
Global Total Semiconductor Equipment Sales Forecast to Reach Record $124 Billion in 2025, SEMI Reports
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach $100 billion in 2023, a contraction of 6.1% from the industry record of $107.4 billion posted in 2022.
ROHM and Toshiba Agree to Collaborate in Manufacturing Power Devices
A plan by ROHM Co., Ltd. and Toshiba Electronic Devices & Storage Corporation to collaborate in the manufacture and increased volume production of power devices has been recognized and will be supported by the Ministry of Economy, Trade and Industry as a measure supporting the Japanese Government’s target of secure and stable semiconductor supply.