Packaging

Axcelis Announces Grand Opening of the Company’s New Logistics Center in Beverly, MA

The Company celebrated this milestone event with a ribbon-cutting ceremony led by President and CEO Russell Low.

Amkor Announces US Advanced Packaging and Test Facility

Amkor Technology, Inc., a provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona.

2D Material Reshapes 3D Electronics for AI Hardware

Researchers demonstrated monolithic 3D integration of layered 2D material into novel processing hardware for artificial intelligence computing. The new approach provides a material-level solution for fully integrating many functions into a single, small electronic chip — and paves the way for advanced AI computing.

TPL for Photonic Packaging: A Promising Solution

In a new paper published in Light Advanced Manufacturing, a team of scientists led by Dr. Shaoliang Yu and Qingyang Du have developed new packaging technologies.

Q3 2023 Global Semiconductor Equipment Billings Drop 11% Year-Over-Year, SEMI Reports

Global semiconductor equipment billings contracted 11% year-over-year to US$25.6 billion in the third quarter of 2023, while quarter-over-quarter billings slipped 1% during the same period.

New Energy Collaborative Aims to Accelerate Creation of Low-Carbon Energy Access in Asia-Pacific for the Semiconductor Climate Consortium

Aiming to reduce global semiconductor ecosystem carbon emissions, SEMI and the Semiconductor Climate Consortium (SCC) have created the Energy Collaborative.

Sony Semiconductor Solutions to Release SWIR Image Sensor

Sony Semiconductor Solutions Corporation (SSS) today announced the upcoming release of the IMX992 short-wavelength infrared (SWIR) image sensor for industrial equipment, with the industry’s highest pixel count, at 5.32 effective megapixels.

MediaTek’s Chairman Ming-Kai Tsai Awarded Prestigious IEEE Robert N. Noyce Medal

MediaTek today announced its chairman Ming-Kai Tsai has been awarded the IEEE Robert N. Noyce Medal, one of the most prestigious awards in the electronics industry.

Festo Announces the Launch of Electeo: A New Web-Based Electronics Training System

Electeo, a new learning solution from Festo, will be unveiled at ACTE CareerTech VISION in Phoenix, Arizona on November 29, 2023.

What’s in the November/December Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the November/December issue.

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