Packaging

CoreFlow Ltd. Introduces GripJet

CoreFlow Ltd. unveiled its GripJet vacuum chuck, a revolutionary solution for advanced wafer-level packaging (AWLP) and other processes.

Untether AI Joins UCIe Consortium to Drive Chiplet Technology and Energy-Centric AI Acceleration

Untether AI today announced that it has joined Universal Chiplet Interconnect Express (UCIe) Consortium, the industry organization that has developed an open specification that defines the interconnect between chiplets within a package.

MACOM Announces the Passing of John Ocampo, Chairman of the Board of Directors

John served as a director and as the Chairman of the Board since MACOM’s inception in March 2009.

Next Generation Semiconductors: Diamond Device Shows Highest Breakdown Voltage

Researchers at the University of Illinois Urbana-Champaign have developed a semiconductor device made using diamond, that has the highest breakdown voltage and lowest leakage current compared to previously reported diamond devices. Such a device will enable more efficient technologies needed as the world transitions to renewable energies.

Revolutionary Breakthrough in the Manufacture of Photovoltaic Cells at the University of Ottawa

Another step towards miniaturization of electronic devices.

Renesas Introduces 32-bit RX MCU with High-Speed, High-Precision Analog Front End for High-End Industrial Sensor Systems

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has expanded its 32-bit microcontroller (MCU) offering with a new RX device for high-end industrial sensor systems.

Weebit Nano Receives Wafers Manufactured in GlobalFoundries’ 22FDX Process

Initial testing has begun on 22nm FD-SOI wafers with embedded Weebit ReRAM.

CHIPS for America Releases Vision for Approximately $3 Billion National Advanced Packaging Manufacturing Program

Today, the Biden-Harris Administration announced its vision to boost U.S. capabilities for advanced packaging, a key technology for manufacturing state-of-the-art semiconductors.

Professors from Purdue University and the University of Virginia to be Honored for Excellence in Semiconductor Research

The Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC) today announced the recipients of the 2023 University Research Awards.

Silicon Labs Expands MCU Platform with New 8-bit MCU family

Silicon Labs today announced the expansion of their microcontroller unit (MCU) development platform with a new family of 8-bit MCUs optimized for price and performance.

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