Entegris, Inc. announced the opening of its Singapore Digital Manufacturing Technology Center (SDMTC).
Packaging
Global Semiconductor Manufacturing Industry Set for Q4 2023 Recovery, SEMI Reports
The global semiconductor manufacturing industry is on track for recovery in the fourth quarter of 2023, setting the stage for continued growth in 2024, SEMI announced today.
SEMICON Europa 2023 Opens Tomorrow to Showcase Sustainability Innovation and Talent Strategies Shaping a $1 Trillion Era
SEMICON Europa 2023 opens tomorrow with industry experts from across the electronics design and manufacturing supply chain gathering to present insights into the latest developments and trends across key semiconductor industry growth segments including advanced packaging, materials, MedTech and mobility.
Cadence EMX 3D Planar Solver Certified for Samsung Foundry 8nm LPP Process Technology
Cadence Design Systems, Inc. today announced that the Cadence EMX 3D Planar Solver is now certified for use with Samsung Foundry’s advanced 8nm Low Power Plus (LPP) process technology.
CEA-Leti Will Present Gains in Ultimate 3D, RF & Power, and Quantum & Neuromorphic Computing with Emerging Devices
Institute to host annual Leti Devices Workshop on Dec. 10: ‘Semiconductor Devices: Moving Towards Efficiency & Sustainability’
FPGA Market Set to Reach $13.6B by 2031 with a Strong 8.1% CAGR
The global FPGA Market was estimated at a value of US$ 6 billion in 2020.
Department of Commerce Reaches Agreement with New Organization, SemiUS, to Operate National Semiconductor Technology Center (NSTC)
Today, the Department of Commerce announced it has reached an initial agreement with a new nonprofit organization called SemiUS, the expected operator for the National Semiconductor Technology Center (NSTC).
ROHM’s New Ultra-High-Speed Gate Driver IC: Maximizing the Performance of GaN Devices
ROHM Semiconductor today introduced the new BD2311NVX-LB gate driver IC, optimized for GaN devices, which achieves gate drive speeds on the order of nanoseconds (ns), ideal for high-speed switching.
Micron First to Enable Ecosystem Partners With the Fastest, Lowest Latency High-Capacity 128GB RDIMMs Using Monolithic 32Gb DRAM
Micron Technology, Inc. today demonstrated its industry leadership by announcing its 32Gb monolithic die-based 128GB DDR5 RDIMM memory featuring best-in-class performance of up to 8000 MT/s1 to support data center workloads today and into the future.
Technological Innovations in Next-Generation Image Sensors Discussed by IDTechEx
The use of image sensors is set to revolutionize multiple industries from advanced driver-assistance system (ADAS)/autonomous driving to agriculture, industrial inspections, and medical imaging.
