In its latest Advanced Packaging Update, TechSearch International provides an update on developments in hybrid bonding including applications, technical challenges, and proposed solutions. The report focuses on hybrid bonding for high-performance applications.
Packaging
Pivotal Systems Opens New Manufacturing Facility in Malaysia to Meet Growing Demand for Gas Flow Solutions
Pivotal Systems Corporation has officially announced the opening of a new high volume manufacturing facility in Malaysia.
Lightmatter and ASE Partner to Bring 3D Photonics to Market
Lightmatter today announced a strategic collaboration with Advanced Semiconductor Engineering, Inc., the world’s largest semiconductor packaging and testing services provider.
Professors from Georgia Tech and University of Michigan To Be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC) today announced the recipients of the 2024 University Research Awards.
Lightmatter and Amkor Technology Partner to Build World’s Largest 3D Photonics Package
Lightmatter today announced a strategic partnership with Amkor Technology, Inc., a provider of semiconductor packaging and test services, to create the largest-ever 3D-packaged chip complex utilizing Lightmatter’s innovative Passage platform.
RED Semiconductor Chosen for Silicon Catalyst Semiconductor Incubator
RED Semiconductor, a UK based startup innovating processors for AI and cryptography at the edge, has won a place to join the semiconductor industry’s highly acclaimed Silicon Catalyst Incubator program.
Pivotal Systems Accelerates Global Expansion with New Manufacturing Facilities in South Korea
Pivotal Systems Corporation, a provider of advanced gas flow control solutions across semiconductor and high-tech industries, announced the opening of its first manufacturing facility in South Korea.
Microtest Group Acquires U.S. Company Focused Test and Enters the U.S. Market
Less than two months after acquiring ipTEST in the United Kingdom, the Microtest Group, an Italian leader in the production of test systems and microchip testing on silicon wafers and packages, has obtained authorization from the U.S. government to proceed with the acquisition of Focused Test.
2025 IEEE Electronic Components and Technology Conference Announces Student Competition
Three winning student teams will receive the opportunity to attend ECTC 2025 for free, including travel costs up to a specified amount.
Renesas Unveils Industry’s First Automotive Multi-Domain SoC Built with 3nm Process Technology
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today launched the new generation of automotive fusion system-on-chips (SoCs), serving multiple automotive domains including Advanced Driver Assistance Systems (ADAS), in-vehicle infotainment (IVI), and gateway applications on a single chip.
