Marvell Technology, Inc. today announced the advancement of its custom XPU architecture with co-packaged optics (CPO) technology.
Packaging
DreamBig Semiconductor Announces Partnership with Samsung Foundry
DreamBig empowers customers to forge the future of AI, datacenter, edge, storage, and automotive solutions by developing application specific processor/accelerator chiplets and composing products by adding the chiplets to MARS Chiplet Platform with world leading Chiplet Hub for scale-up and Networking IO Chiplets for scale-out.
ASU Research Park Named as Planned Site for Third CHIPS for America R&D Flagship Facility
Facility is expected to host the world’s first 300mm front-end semiconductor manufacturing and advanced packaging research facility.
2025 Outlook: Executive Viewpoints
Each year, Semiconductor Digest turns to industry leaders and analysts to get their viewpoints on what they expect to see in the coming year in terms of critical tech and business trends.
2025: Navigating Shifts in Semiconductor Demand
I would expect numbers for wafer fab equipment (WFE) to be between 5% and 10% growth, reaching the low $100 billions for 2025.
2025: MRAM’s Path Forward in a Demanding Landscape
Spin-transfer-torque magnetoresistive random access memory (STT-MRAM) continues to stand out by meeting critical demands for high endurance, non-volatility, and low latency, particularly in applications at the far edge.
2025: Wafer Bonding is the New Semiconductor Scaling
To continue scaling the power density of future semiconductor components, there is no way around 3D integration. Depending on the system requirements, various bonding technologies such as solder connections, thermocompression and hybrid bonding can be selected.
2025: The Increasing Importance of High-Performance Power Management
Power management devices, which include voltage regulators and power converters, are critical components that ensure optimal energy consumption and performance in the most advanced electronic systems, including artificial intelligence (AI) and machine learning.
2025: Power Density and Sustainability Shaping Semiconductor Landscape
As devices become more compact and powerful, traditional packaging methods are no longer sufficient. Techniques such as system-in-package (SiP) and 3D packaging will gain traction, enabling higher performance while minimizing space and volume.
2025: AI Momentum Continues
The optical interposer, which POET pioneered, is gaining traction as a platform technology that can meet the high-volume production requirements of AI clusters while reducing cost and power consumption.
