DELO has developed a new approach for fan-out wafer-level packaging (FOWLP).
Packaging
The Busch Group Drives Sustainable Future Technologies
October 24 is International Day of Climate Action, which aims to raise awareness of climate change and to highlight the importance of environmental protection.
Fractile Licenses Andes Technology’s RISC-V Vector Processor
Andes Technology, a supplier of high-efficiency, low-power 32/64-bit RISC-V processor cores and Founding Premier member of RISC-V International, announced a partnership with Fractile, the company building the chips and systems needed to reach the next frontier of AI performance.
U.S.-Canada Collaboration Grows with Bilateral Discussions Between C2MI and NY CREATES
The cross-border collaboration between Canadian and U.S. semiconductor-centered R&D, prototyping, and manufacturing industries continues to focus on ways to connect to expand opportunities as C2MI (MiQro Innovation Collaborative Centre), based in Bromont, Québec, Canada, and NY CREATES, based in Albany, NY, build upon their partnership that began in early 2024.
SPIE Photonics West 2025 Now Open for Registration
This year, the week will include 4,500-plus technical presentations across more than 100 technical conferences, as well as hosting over 1,200 companies in four focused exhibitions.
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
SEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.
Kioxia to Unveil Emerging Memory Technologies at IEDM 2024
Kioxia Corporation today announced that the company’s research papers have been accepted for presentation at IEEE International Electron Devices Meeting (IEDM) 2024, a prestigious international conference to be held in San Francisco, USA, from December 7th to 11th.
IDTechEx Report Highlights the Rise of Chiplet Technology in Semiconductors
The report highlights how chiplets offer a promising path forward, providing flexibility, modularity, customizability, efficiency, and cost-effectiveness in chip design and manufacturing.
Samsung Develops Industry’s First 24Gb GDDR7 DRAM for Next-Generation AI Computing
Samsung Electronics Co., Ltd. today announced it has developed the industry’s first 24-gigabit (Gb) GDDR7 DRAM.
Microchip’s RTG4 FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification
QML Class V designation recognizes exceptional reliability and longevity for critical space missions.
