A plan by ROHM Co., Ltd. and Toshiba Electronic Devices & Storage Corporation to collaborate in the manufacture and increased volume production of power devices has been recognized and will be supported by the Ministry of Economy, Trade and Industry as a measure supporting the Japanese Government’s target of secure and stable semiconductor supply.
Packaging
GlobalFoundries Names John Hollister as Chief Financial Officer
GlobalFoundries today announced that John Hollister will join the company as Chief Financial Officer (CFO), effective February 5, 2024.
SEMI Applauds Advancement of U.S. CHIPS and Science Act Incentives
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the first award of U.S. CHIPS and Science Act incentives to strengthen the United States semiconductor industry ecosystem.
Biden-Harris Administration and BAE Systems, Inc. Announce CHIPS Preliminary Terms to Support Critical U.S. National Security Project in Nashua, New Hampshire
The Department’s PMT with BAE Systems, Inc., marks the beginning of the next phase of implementation of the CHIPS and Science Act, a key part of President Biden’s Investing in America agenda.
SEMI Launches Leadership Accelerator to Cultivate Future-Ready Microelectronics Industry Leaders
SEMI today announced the SEMI Leadership Accelerator to foster industry growth by assisting organizations in cultivating the next generation of leaders.
Global Semiconductor Alliance Announces Winners of 2023 GSA Awards
Last night, the Global Semiconductor Alliance (GSA) celebrated the achievements of remarkable individuals and exceptional semiconductor companies at its annual GSA Awards Ceremony gala. Join us in congratulating this year’s recipients.
Thermal Impact of 3D Stacking Photonic and Electronic Chips
Researchers investigate how the thermal penalty of 3D integration can be minimized.
EV Group Brings Revolutionary Layer Transfer Technology to High-Volume Manufacturing With EVG850 NanoCleave System
Infrared laser cleave technology enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and transistor scaling.
NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data for Ground-Breaking 3D X-DRAM
NEO Semiconductor, a developer of technologies for 3D NAND flash and DRAM memory, today announced findings of 3D X-DRAM simulations.
Micron Unveils Client SSD to Fuel Demanding PC Applications
Micron Technology, Inc. today announced it is shipping the Micron 3500 NVMe SSD, which leverages its 232-layer NAND to power demanding workloads for business applications, scientific computing, cutting-edge gaming and content creation, pushing the limits of what is possible.
