This week at its annual Technology Summit in Europe, GlobalFoundries announced advancements to its industry-leading 22FDX (22nm FD-SOI) platform, introducing a suite of innovative features and enhancements.
Packaging
USPAE, DoD Launch $10 Million Defense Business Accelerator to Innovate Commercialization of Advanced Electronics
In a major initiative to innovate how the Department of Defense (DoD) spurs commercial technology development, the U.S. Partnership for Assured Electronics (USPAE) and DoD launched a Defense Business Accelerator (DBX) to open doors for industrial base growth and stimulate private investment.
Brooks Instrument Opens New Manufacturing Site in Malaysia
Brooks Instrument has opened a new manufacturing facility in Penang, Malaysia, significantly increasing its operational footprint in Asia-Pacific for producing mass flow controllers (MFCs).
FMI Analyst View: “Shaping the Future of Protection: Hermetic Packaging Solutions”
The hermetic packaging market is poised to increase at a 4.2% CAGR from 2023 to 2033, acquiring a market value of US$ 5.2 billion by the end of 2033, up from US$ 3.4 billion in 2023.
Cadence Digital and Custom/Analog Design Flows Achieve the Latest TSMC N2 Certification
Cadence Design Systems, Inc. today announced its digital and custom/analog flows have achieved certification for TSMC’s latest N2 Design Rule Manual (DRM).
Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC’s Advanced 4nm RF FinFET Process
Keysight Technologies, Inc., Synopsys, Inc, and Ansys announced a new reference flow for the TSMC N4PRF, the world’s leading semiconductor foundry’s advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.
GlobalFoundries and Microchip Announce Microchip’s 28nm SuperFlash Embedded Flash Memory Solution in Production
GlobalFoundries and Microchip Technology, via its Silicon Storage Technology (SST) subsidiary, today announces the immediate release to production of the SST ESF3 third-generation embedded SuperFlash non-volatile memory (NVM) solution in the GF 28SLPe foundry process.
Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process
Synopsys, Inc. today announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC’s 3DFabric technologies.
GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding
GlobalFoundries announced today it has applied for U.S. CHIPS and Science Act Funding, with two full applications submitted to the CHIPS Program Office of the U.S. Department of Commerce.
Synopsys Unveils Industry’s Broadest Portfolio of Automotive-Grade IP on TSMC’s N5A Process Technology
Today, Synopsys, Inc. announced the industry’s broadest portfolio of automotive-grade Interface and Foundation IP for TSMC’s N5A process.
