Samsung’s groundbreaking development for its 7.5 gigabits-per-second (Gbps) LPCAMM has completed system verification through Intel’s platform.
Packaging
Semiconductor Supply Chain Problems Running Rampant?
Solutions to mitigate future materials supply vulnerabilities.
Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes
Synopsys, Inc. today announced its analog design migration flow is enabled across TSMC’s advanced process technologies, including N4P, N3E, and N2.
SEMI North America Advisory Board Welcomes New Members From Axcelis, Edwards Vacuum, Lam Research and Teradyne
SEMI today announced the election of four new members to the SEMI North America Advisory Board.
Linx Consulting to Host Conference and Workshop this November
The Electronic Specialty Gases & Systems Conference 2023 will be held November 14 to 16, 2023 at Gila River Resorts in Chandler, AZ.
Purdue Center Addresses Pressing Challenge of Securing Semiconductor Chips
Purdue University’s emergence as a leader in semiconductor chips also requires it to usher in a new level of security that protects those essential chips needed for everything from your car and cellphone to artificial intelligence and machine learning.
Deputy Secretary of Defense Kathleen Hicks Announces $238M CHIPS and Science Act Award
Deputy Secretary of Defense Kathleen Hicks announced the award today of $238 million in “Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act” funding for the establishment of eight Microelectronics Commons (Commons) regional innovation hubs.
Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports
Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm volume fabs (excluding EPI) as the industry reaches a record high of more than 7.7 million wafers per month.
Marposs Introduces the MICROMEASURE 2 3D Measuring System
Marposs Inc. announced the latest addition to its highly successful line of Industry 4.0 metrology solutions, the STIL MICROMEASURE 2 3D Measuring System.
OMNIVISION Announces New TheiaCel Technology and Automotive Image Sensor for LED-Flicker-Free Exterior Cameras
OMNIVISION today debuted its OX08D10 8-megapixel (MP) CMOS image sensor with TheiaCel technology at AutoSens Brussels.
