Micron Technology, Inc. announced today that its low-power double data rate 5X (LPDDR5X) DRAM and Universal Flash Storage (UFS) 3.1 embedded solutions are now qualified on Qualcomm Technologies’ latest extended reality (XR) platform, Snapdragon XR2 Gen 2 Platform.
Packaging
ROHM’s New Five-Model Lineup of Low ON-Resistance 100V Dual MOSFETs
Lower power consumption and smaller size of fan motors applied in communication base stations and industrial equipment with 5.0mm × 6.0mm and 3.3mm × 3.3mm sizes.
New Institute Accelerates Future of Microelectronic System Integration, Advanced Packaging
Purdue collaborates with Cadence, imec, SRC, Osaka University to bolster rapid technology development in U.S.
GlobalFoundries Awarded $35 Million Funding from U.S. Government to Accelerate Manufacturing of Next-Generation GaN Chips
In partnership with U.S. Government, GF’s semiconductor manufacturing facility in Vermont continues to move closer to large-scale production of next-generation gallium nitride chips for use in aerospace and defense, cellular communications, industrial IoT and automobiles.
Purdue Silicon Summit Further Accelerates Momentum with Announcements and Brings National, Global Semiconductor Leaders to Campus
Purdue University will host the 2023 Purdue Silicon Summit starting Oct. 17 and continuing through Oct. 25.
Ushering in the Era of Light-Powered ‘Multi-Level Memories’
The Korea Institute of Science and Technology (KIST) announced that has developed a new zero-dimensional and two-dimensional (2D-0D) semiconductor artificial junction material and observed the effect of a next-generation memory powered by light.
Fraunhofer IESE Partners With Arteris To Accelerate Advanced Network-on-chip Architecture Development for AI/ML Applications
Combining FlexNoC and Ncore from Arteris with Fraunhofer IESE DRAMSys4.0 enables customers to improve performance, reduce cost and accelerate the advanced DRAM-centric SoC development schedules.
USPAE Announces Significant Response to DBX Microelectronics Challenge
The U.S. Partnership for Assured Electronics (USPAE) today announced that the Defense Business Accelerator (DBX) Microelectronics Challenge received twice the number of entries expected.
Limiting Sales of Semiconductors to China Will Reduce U.S. Competitiveness, Says ITIF
ITIF, the leading think tank for science and technology policy, released the following statement from ITIF President Robert D. Atkinson
Micron Delivers Industry-Leading Mainstream PCIe Gen4 Data Center SSD
Micron Technology, Inc. today announced the Micron 7500 NVMe SSD for data center workloads.
