Agile Analog, the customizable analog IP company, has become a member of the TSMC IP Alliance Program, a key component of the TSMC Open Innovation Platform (OIP).
Packaging
MRSI Introduces 705HF High Force Die Bonder for Power Devices and Advanced Chip Packaging
MRSI Systems, a manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high force die bonder, a new variant of the proven MRSI-705 platform.
Dr. Lawrence T. Pileggi of Carnegie Mellon University to be Honored With 2023 Phil Kaufman Award
Dr. Lawrence Pileggi, Coraluppi Head and Tanoto Professor of Electrical and Computer Engineering at Carnegie Mellon University, will be honored with the 2023 Phil Kaufman Award for distinguished contributions to Electronic System Design (ESD).
Chiplets Reduce Development Time and Cost
Chiplet Summit announces its second annual event on February 6-8 at the Santa Clara Convention Center.
ROHM’s New EcoGaN Power Stage ICs Contribute to Smaller Size and Lower Loss
ROHM Semiconductor today announced the BM3G0xxMUV-LB series of power stage ICs with built-in 650V GaN HEMTs and gate drivers.
Samsung Electronics Unveils Industry’s Highest-Capacity 12nm-Class 32Gb DDR5 DRAM
Samsung Electronics Co., Ltd. today announced that it has developed the industry’s first and highest-capacity 32-gigabit (Gb) DDR5 DRAM1 using 12 nanometer (nm)-class process technology.
Toshiba Releases 3rd Generation SiC MOSFETs for Industrial Equipment with Four-Pin Package that Reduces Switching Loss
The new products are the first in Toshiba’s SiC MOSFET line-up to use the four-pin TO-247-4L(X) package, which allows Kelvin connection of the signal source terminal for the gate drive.
Metal Plating Chemicals Revenues to Boost into 2024
Growth driven by developments in leading edge logic and memory.
GOWIN Semiconductor & Andes Technology Corp. Announce The First Ever RISC-V CPU and Subsystem Embedded 22nm SoC FPGA
This integration, one of the first complete RISC-V microcontrollers in an FPGA, provides designers the A25 processor power and the peripherals most processors require without consuming any FPGA resources.
SEMI SOI Industry Consortium Elects New Leadership and Governing Council and Announces Upcoming Events
SOI Industry Consortium (SOIIC), a SEMI Technology Community, today announced new leadership, Governing Council members and upcoming educational events for the ecosystem of chip designers, developers, and equipment and materials providers in the silicon on insulator ecosystem.
