Packaging

2025: The Increasing Importance of High-Performance Power Management

Power management devices, which include voltage regulators and power converters, are critical components that ensure optimal energy consumption and performance in the most advanced electronic systems, including artificial intelligence (AI) and machine learning.

2025: Power Density and Sustainability Shaping Semiconductor Landscape

As devices become more compact and powerful, traditional packaging methods are no longer sufficient. Techniques such as system-in-package (SiP) and 3D packaging will gain traction, enabling higher performance while minimizing space and volume.

2025: AI Momentum Continues

The optical interposer, which POET pioneered, is gaining traction as a platform technology that can meet the high-volume production requirements of AI clusters while reducing cost and power consumption.

2025: Expanded GEM300 Standard Usage and Cybersecurity

As we look toward 2025, one trend we observe gaining momentum is the increased adoption of GEM300 standards for wafer sizes smaller than 300mm.

2025: Sustainability and Photonics

For managing the energy needed for data processing, a key future technology will be silicon photonics, which enables seamless integration of optical components like waveguides, switches, and modulators with electronic circuits on a single silicon chip. 

2025: MEMS Move to 300mm

The move to 300mm wafers as a substantial leap forward for the MEMS industry in manufacturing automation and cost-effectiveness, yet many challenges remain.

2025: Optimizing Automated Test Equipment for the Era of AI and Beyond

The role of advanced ATE systems will become even more critical; smaller geometries increase test sensitivity requirements, demanding ATE systems with higher precision and accuracy.

2025: Advancements in Litho Technologies Enabling Next-Generation Multi-Chip Systems

As advanced packing gains momentum, the industry will be looking to novel, creative processing solutions to handle the integration imperatives of today – and tomorrow.

2025: New Packaging Approaches Drive Cost and Efficiency

The fast adoption of chiplets will continue to drive wafer-level packaging (WLP) growth in 2025, as semiconductor companies continue to invest in various types of packages for diverse applications.

2025: Opportunities Abound for Semiconductor Equipment

As we look ahead to 2025, we’re seeing three major trends: a growing compound semiconductor market, the resurgence of wet bench technology and growing workforce development needs.

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