Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHIPS and Science Act.
Packaging
KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
Today KLA Corporation introduced the industry’s widest breadth of process control and process-enabling solutions for IC substrate (ICS) manufacturing.
Forge Nano Receives $10M Investment from GM Ventures
GM plans to utilize Forge Nano’s Atomic Armor surface engineering platform technology to pursue battery cathode material enhancements.
Rambus Unveils Industry-First Complete Chipsets for Next-Generation DDR5 MRDIMMs and RDIMMs
Rambus Inc. today unveiled industry-first, complete memory interface chipsets for Gen5 DDR5 RDIMMs and next-generation DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMMs).
Intel and AMD Form x86 Ecosystem Advisory Group
Intel Corp. and AMD today announced the creation of an x86 ecosystem advisory group bringing together technology leaders to shape the future of the world’s most widely used computing architecture.
Biden-Harris Administration Announces Preliminary Terms with Wolfspeed
Proposed CHIPS investment of up to $750M would support construction of world’s largest silicon carbide 200mm ecosystem and create over 5,000 jobs in North Carolina and New York.
Mouser Electronics Celebrates Its 2024 Best-in-Class Award Winners
Mouser Electronics, Inc. announced the 2024 recipients of the Mouser Best-in-Class Awards. The annual awards event occurred on October 10 near the global distributor’s corporate headquarters in the Dallas/Fort Worth Metroplex.
SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future
Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.
IMEC Announces Commitments to Automotive Chiplet Program
This week, at an exclusive gathering in Detroit (MI), bringing together the global automotive ecosystem to discuss the evolution towards chiplets in cars (Automotive Chiplet Forum 2024), imec announced that Arm, ASE, BMW Group, Bosch, Cadence Design Systems, Inc., Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo are the first that have committed to join its Automotive Chiplet Program (ACP).
What’s in the October Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the October issue.
