Packaging

Silicon Fabricated Parts Market Forecasting High Growth

Increased layer technology and OLED growth driving demand for silicon parts.

SK hynix Develops World’s Best Performing HBM3E

SK hynix Inc. announced today that it successfully developed HBM3E, the next-generation of the highest-specification DRAM for AI applications currently available, and said a customer’s evaluation of samples is underway.

IDTechEx Discusses Chips as Currency: America, China, and the AI Race

Running in the background to the more visible, very real wars occurring around the world at present, there is another, economic and industrial in nature.

Bruker to Acquire PhenomeX

Bruker Corporation and PhenomeX Inc. today announced that they have signed a definitive agreement for Bruker to acquire PhenomeX for $1.00 per share in an all-cash transaction.

Infineon Introduces New Automotive 60 V and 120 V OptiMOS 5 in TOLx Packages

The automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in the coming years.

Moov, the Largest Global Marketplace for Semiconductor Equipment, Expands Presence in Taipei

Moov, the largest and fastest growing global marketplace for used semiconductor equipment, today announced it will be expanding its presence in Taipei with a new office located in Taipei and dedicated staff on the ground.

Blueshift Memory Announces Flash Memory Summit Best in Show Award for Cambridge Architecture

Blueshift Memory, designer of a novel proprietary high-speed memory architecture, has announced that the Cambridge Architecture has been selected to receive the Most Innovative Memory Technology award in the Memory Accelerator Architecture category at last week’s Flash Memory Summit Best in Show Awards in Santa Clara – the world’s largest computer memory event.

Synopsys Announces Sassine Ghazi to Assume President and CEO Role Jan. 1, 2024

Synopsys, Inc. today announced that its Board of Directors has appointed Sassine Ghazi as president and Chief Executive Officer effective on Jan. 1, 2024.

SIA Statement on Outbound Investment Proposal

The Semiconductor Industry Association (SIA) today released the following statement regarding new administration actions related to outbound investment screening.

Greene Tweed Introduces Chemraz G57 Premium Elastomer

Greene Tweed, a global manufacturer of high-performance sealing solutions and engineered components, announces the introduction of Chemraz G57, a perfluoroelastomer that Greene Tweed material scientists and application engineers specifically developed to meet the demands of aggressive dry plasma systems and other extremely demanding semiconductor fabrication sealing applications.

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