Greene Tweed, a global manufacturer of high-performance sealing solutions and engineered components, announces the introduction of Chemraz G57, a perfluoroelastomer that Greene Tweed material scientists and application engineers specifically developed to meet the demands of aggressive dry plasma systems and other extremely demanding semiconductor fabrication sealing applications.
Packaging
Biden-Harris Administration Making Progress One-Year into CHIPS for America
This week marked the one-year anniversary of President Biden signing the bipartisan CHIPS and Science Act into law as part of his investing in America agenda.
One Year After Enactment, CHIPS & Science Act is on Path to Success; Work Remains to Maximize Impact
Semiconductor Industry Association (SIA) President and CEO John Neuffer today released the following statement regarding the one-year anniversary of enactment of the CHIPS and Science Act, a landmark law that provides $52 billion for semiconductor manufacturing incentives and research initiatives.
IDTechEx Discusses Next-Generation RDL Materials in Advanced Semiconductor Packaging
With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology.
Nordson’s Semiconductor Advanced Packaging Solutions Will Be Demonstrated at SEMICON Taiwan 2023
Nordson Electronics Solutions will demonstrate the latest solutions for semiconductor advanced packaging at the SEMICON Taiwan tradeshow booth L0800, Hall 1, 4th floor.
TSMC to Build Multi-Billion-Euro Chip Factory in Germany
Taiwanese semiconductor manufacturer TSMC plans to construct a massive new production facility in the eastern German city of Dresden.
NEO Semiconductor 3D X-DRAM Awarded “Best of Show” for Most Innovative Memory Technology
NEO Semiconductor, a developer of innovative technologies for 3D NAND flash and DRAM memory, today announced that its ground-breaking technology, 3D X-DRAM, captured the top prize at Flash Memory Summit 2023, winning the “Best of Show” award for the Most Innovative Memory Technology.
Intel Federal, Qorvo, Ayar Labs, and Lockheed Martin ATL Win Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output (KANAGAWA) Prototype Project
The Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) OTA announced Ayar Labs, Intel, Lockheed Martin ATL, and Qorvo are the prime awardees of the Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output (KANAGAWA) prototype project.
SK hynix Showcases Samples of World’s First 321-Layer NAND
SK hynix Inc. showcased today the sample of the 321-layer 4D NAND, making public the progress on its development of the industry’s first NAND with more than 300 layers.
SMC 2023 Keynotes and Sessions: Paving the Way to the Next Semiconductor Industry Super Cycle
With advanced materials a critical enabler of semiconductor growth applications, Strategic Materials Conference (SMC 2023) will gather top executives and leaders from every segment of semiconductor manufacturing for insights into the latest developments in advanced materials October 2-4, 2023 at the Holiday Inn in San Jose, Calif.
