Tinkering with the makeup of inexpensive LED lights boosted their brightness and efficiency, but the new lights only lasted a few minutes.
Packaging
Synopsys Appoints Jill Larsen as Chief People Officer
Synopsys, Inc. today announced that Jill Larsen has joined the company as Chief People Officer, responsible for leading the Synopsys People and Workplace Resources organization.
Advantest Rolls Out Thermal Control Products for MPT3000 Solid-State Drive Test Platform
Semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced two new additions to its MPT3000 solid-state drive (SSD) test platform.
SEMI Announces Intent to Host SEMICON India in Partnership with India Semiconductor Mission
SEMI today announced its intent to support the India Semiconductor Mission (ISM) in creating a vibrant semiconductor manufacturing and design ecosystem in India.
Archer Further Enhances Biochip gFET Design for Advanced Sensing and Sends to Commercial Foundry Partner
Archer Materials Limited, a semiconductor company advancing the quantum computing and medical diagnostics industries, has developed a next generation biochip fabrication to better detect and control disease samples on a single graphene field effect transistor design.
TechSearch International, Inc. Examines Advanced Packaging’s Growth in AI
TechSearch International’s latest analysis examines demand for packages used in AI.
ASU-TSMC Partnership Will Focus on Student Support, Recruitment, Faculty Research
Arizona State University and the Taiwan Semiconductor Manufacturing Company (TSMC) today announced a partnership agreement focused on student support, training and recruitment, and faculty work projects and research that will deepen the existing relationship between ASU and the world’s leading manufacturer of semiconductor chips.
SkyWater Florida and BRIDG Announce Installation of Nordson’s Leading C-SAM System to Enhance Metrology Capabilities at the Center for Neovation
The new tool will be utilized by SkyWater Florida to enhance onsite metrology capabilities for advanced packaging and heterogeneous integration technology.
POET Technologies Announces Sample Availability of 100G LR4 Optical Engines and Testing with Three Lead Customers
POET Technologies Inc., the designer and developer of the POET Optical Interposer and Photonic Integrated Circuits (PICs) for the data center, telecommunication and artificial intelligence markets, today announced sample readiness of 100G LR4 Transmit and 100G LR4 Receive optical engines that are part of “POET Legacy” product family.
Department of Commerce and Department of Defense Sign Memorandum of Agreement to Strengthen U.S. Defense Industrial Base
The United States Departments of Commerce (DoC) and Defense (DoD) have signed a Memorandum of Agreement (MOA) to expand collaboration to strengthen the U.S. semiconductor defense industrial base.
