Applied Materials, Inc. today introduced materials, technologies and systems that help chipmakers integrate chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs). The new solutions extend Applied’s industry-leading breadth of technologies for heterogeneous integration (HI).
Packaging
What’s in the July Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the July issue. Pick up your copy in print at SEMICON West in the publication bins and at the Semiconductor Digest Booth 1829.
ChipFlow Raises £1.2M in Pre-Seed Funding to Democratize Semiconductor Design Through Open-Source Software Tools
The oversubscribed financing round, which was led by Fontinalis Partners, includes participation from Fuel Ventures, InMotion Ventures, the investment arm of JLR, APX, and others.
3D-Micromac to Present Breakthroughs in Laser Micromachining for Semiconductor Manufacturing and Advanced Packaging at SEMICON West
Power devices, magnetic sensors, microLEDs, and advanced packaging among myriad applications enabled by 3D-Micromac’s laser micromachining solutions.
Renesas and Wolfspeed Sign 10 Year Silicon Carbide Wafer Supply Agreement
The supply of high-quality silicon carbide wafers from Wolfspeed will pave the way for Renesas to scale production of silicon carbide power semiconductors starting in 2025.
IDTechEx Explores Materials and Processing for Advanced Semiconductor Packaging
Semiconductor packaging has evolved from board-level to wafer-level integration, bringing notable advancements.
Microchip Launches $300M Multi-Year Investment Initiative to Expand its Presence in India
Includes funding for facilities, engineering labs, talent acquisition and support for regional technology consortia and educational institutions.
Semiconductor Market Extends Record Decline into Fifth Quarter
New research from Omdia reveals that the semiconductor market declined in revenue for a fifth straight quarter in the first quarter of 2023.
Semtech Adds Semiconductor Industry Leader to Board of Directors
Semtech Corporation, a high-performance semiconductor, IoT systems and cloud connectivity service provider, today announced the appointment of Hong Q. Hou to the Company’s board of directors, effective July 1, 2023.
Bechtel Establishes Office in Chandler, Arizona
Bechtel announced today that it will establish a new office in Chandler, Arizona.
