Packaging

FormFactor and Advantest Partner on Silicon Photonics Wafer-Level Test Cell to Enable High-Volume Manufacturing

FormFactor, Inc. and Advantest Corporation announced today a strategic partnership to develop a novel test cell and measurement system designed for high-volume production of silicon photonics (SiPh) and co-packaged optics (CPO) devices.

ACM Research Announces Major Performance Breakthrough for Ultra C Tahoe Cleaning Tool for Front-End Semiconductor Manufacturing

ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced a major performance breakthrough for its flagship Ultra C Tahoe Cleaning tool.

Empower Semiconductor Showcases Cutting-Edge Vertical Power Architecture for AI and HPC Processors at electronica 2024

Empower Semiconductor will demonstrate its new Crescendo platform with FinFast technology at electronica 2024, the world’s leading trade fair and conference for electronics.

European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost Competitiveness of Semiconductor Ecosystem

The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, today announced the publication of the Skills Strategy report by DECISION Etudes & Conseil that outlines the strategic approaches required to tackle Europe’s growing talent shortage in the semiconductor sector.

Pfeiffer Vacuum+Fab Solutions Introduces New Handheld Measuring Gauge

Pfeiffer Vacuum+Fab Solutions – a member of the Busch Group – introduces the TPG 202 Neo, a new Piezo/Pirani handheld gauge designed to meet the demands of various industrial and laboratory environments.

Emerging Trends and Key Markets in 2.5D and 3D Semiconductor Packaging Technologies

This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.

SIA Commends Selections for CHIPS R&D Flagship Facilities

The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities.

Infineon Launches New Generation of GaN Power Discretes

Infineon Technologies AG today announced the launch of a new family of high-voltage discretes, the CoolGaN Transistors 650 V G5, further strengthening its Gallium Nitride (GaN) portfolio.

Research for the Future, Application Transfer for the Present

Advancements in industry and technology are constantly demanding new solutions for the manufacturing of microchips regarding the technical, economic and also ecological perspective.

Onto Innovation Announces “Tuck-In” Acquisition of Lumina Instruments, Inc. and Lithography Business of Kulicke and Soffa

Onto Innovation Inc., a global provider of process control and packaging lithography solutions to the semiconductor market, today announced that it has acquired Lumina Instruments, Inc. based in Milpitas, California.

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