Continuing softness in demand for semiconductors and challenging macroeconomic conditions are driving the 2023 decline.
Packaging
STMicroelectronics’ Dual-Inline Silicon-Carbide Power Modules Offer Versatile Package Configurations for Automotive Applications
STMicroelectronics has released the ACEPACK DMT-32 family of silicon carbide (SiC) power modules in a convenient 32-pin, dual-inline, molded, through-hole package for automotive applications.
Dr. Rick Tsai to Receive Global Semiconductor Alliance’s Highest Honor, the Dr. Morris Chang Exemplary Leadership Award
Global Semiconductor Alliance (GSA) proudly announces it will honor Dr. Rick (Lih Shyng) Tsai, the CEO and Vice Chairman of MediaTek with its prestigious Dr. Morris Chang Exemplary Leadership Award at this year’s Annual Awards Celebration on December 7, 2023.
SEMICON Europa 2023 to Highlight Chip Industry Investments, Sustainability and Talent Strategies to Shape $1 Trillion Era
The event, Europe’s premier exhibition and conference for the microelectronics supply chain, will feature keynotes from the electronics design and manufacturing ecosystem, academia and government.
Gartner Forecasts Worldwide IT Spending to Grow 8% in 2024
Worldwide IT spending is projected to total $5.1 trillion in 2024, an increase of 8% from 2023, according to the latest forecast by Gartner, Inc.
Micron Low-Power Memory Solution Boosts Mixed and Virtual Reality Experiences on Snapdragon XR2 Gen 2
Micron Technology, Inc. announced today that its low-power double data rate 5X (LPDDR5X) DRAM and Universal Flash Storage (UFS) 3.1 embedded solutions are now qualified on Qualcomm Technologies’ latest extended reality (XR) platform, Snapdragon XR2 Gen 2 Platform.
Micron Low-Power Memory Solution Boosts Mixed and Virtual Reality Experiences on Snapdragon XR2 Gen 2
Micron Technology, Inc. announced today that its low-power double data rate 5X (LPDDR5X) DRAM and Universal Flash Storage (UFS) 3.1 embedded solutions are now qualified on Qualcomm Technologies’ latest extended reality (XR) platform, Snapdragon XR2 Gen 2 Platform.
ROHM’s New Five-Model Lineup of Low ON-Resistance 100V Dual MOSFETs
Lower power consumption and smaller size of fan motors applied in communication base stations and industrial equipment with 5.0mm × 6.0mm and 3.3mm × 3.3mm sizes.
New Institute Accelerates Future of Microelectronic System Integration, Advanced Packaging
Purdue collaborates with Cadence, imec, SRC, Osaka University to bolster rapid technology development in U.S.
GlobalFoundries Awarded $35 Million Funding from U.S. Government to Accelerate Manufacturing of Next-Generation GaN Chips
In partnership with U.S. Government, GF’s semiconductor manufacturing facility in Vermont continues to move closer to large-scale production of next-generation gallium nitride chips for use in aerospace and defense, cellular communications, industrial IoT and automobiles.
