Pfeiffer Vacuum Technology AG announced a seven-year, €75 million investment plan for its Annecy site at the “Choose France” summit for foreign investors.
Packaging
ROHM’s New Class-Leading Low ON Resistance N-Channel MOSFETs
ROHM Semiconductor today announced the RS6xxxxBx / RH6xxxxBx series of N-channel MOSFETs (40V/60V/80V/100V/150V; 13 part numbers) suitable for applications operating on 24V/36V/48V power supplies, such as base stations, servers, and motors for industrial and consumer equipment.
CEA-Leti Proof of Concept Demonstrates Electrons Move Faster in Germanium Tin Than in Silicon or Germanium
CEA-Leti research scientists have demonstrated that electrons and other charge carriers can move faster in germanium tin than in silicon or germanium, enabling lower operation voltages and smaller footprints in vertical than in planar devices.
Semtech Announces New President and CEO
Semtech Corporation today announced that its board of directors has appointed Paul H. Pickle as Semtech’s new president and chief executive officer.
Nordson Test & Inspection Unveils New X-Ray Inspection System
Nordson Test & Inspection will unveil the new Quadra 7 Pro Manual X-Ray Inspection (MXI) system at SEMICON China.
ASM Breaks Ground on New Innovation and Manufacturing Center in Hwaseong, Korea
ASM International N.V. will take its symbolic first step in bringing its US$100 million multi-year investment in Hwaseong (Dongtan), South Korea, to fruition, with the groundbreaking ceremony tomorrow on its expanded innovation and manufacturing center.
Toshiba Releases Small Photorelay with High Speed Turn-On Time that Helps Shorten Test Time for Semiconductor Testers
Toshiba Electronic Devices & Storage Corporation has launched “TLP3476S,” a photorelay in the S-VSON4T package that cuts turn-on time to half that of Toshiba’s current product, TLP3475S. Volume shipments start today.
Alchip Technologies Sets Record Q1 Revenue
Historically strong artificial intelligent chip shipments to North American customer accounted for much of the significant jump in first quarter revenue, according to President and CEO Johnny Shen.
IEEE International Electron Devices Meeting (IEDM) Announces 2023 Call for Papers
Under the theme “Devices for a Smart World Built Upon 60 Years of CMOS,” the 69th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
Ayar Labs Adds $25 Million in Expansion of Its $130 Million Series C
Ayar Labs today announced it has raised an additional $25 million in Series C1 funding, bringing its total Series C raise to $155 million.
