EV Group and Dymek Company today announced that they have established a new joint venture company in Malaysia.
Packaging
SEMI North America Advisory Board Welcomes New Members From ASML and Breker Verification Systems
SEMI today announced the election of two new members to the SEMI North America Advisory Board (NAAB): Maheen Hamid, co-founder, CFO and COO of Breker Verification Systems, and Michael Lercel, Senior Director of Global Strategic Marketing at ASML.
Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027
Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022.
XlynX Crosslinker Enables Ultra-Stable Perovskite Solar Cells
The past decade has seen remarkable progress in the field of perovskite solar cells (PSCs), a next-generation technology that offers a lower cost and easier to manufacture alternative to conventional silicon solar cells.
SEMICON Southeast Asia 2023 Opens Tomorrow with Chip Industry Resilience and Growth in Focus
SEMICON Southeast Asia opens tomorrow with critical semiconductor industry topics including supply chain resilience, sustainability, Smart Manufacturing, Smart Mobility, Smart MedTech, and workforce development in focus.
Purdue Signs Landmark U.S.-Japan Agreement in Semiconductors at G7 Summit
On Sunday (May 21) in Hiroshima, Japan, Purdue President Mung Chiang signed another landmark international agreement, partnering with Micron, Tokyo Electron and other educational institutions in the United States and Japan to establish the “UPWARDS Network” for workforce advancement and research and development in semiconductors.
Applied Materials Launches Multibillion-Dollar R&D Platform
Applied Materials, Inc. today announced a landmark investment to build the world’s largest and most advanced facility for collaborative semiconductor process technology and manufacturing equipment research and development (R&D).
Micron Launches U.S.-Japan University Partnership
Eleven-university strong network to grow the next-generation workforce and advance semiconductor-based research in both countries.
Penn State and onsemi Sign MOU to Boost Silicon Carbide Research in the United States
onsemi and Penn State announced the signing of a memorandum of understanding (MOU) towards an $8 million strategic collaboration which includes the establishment of the onsemi Silicon Carbide Crystal Center (SiC3) at Penn State’s Materials Research Institute (MRI). onsemi will fund SiC3 with $800k per year over the next 10 years.
Massachusetts Launches Portal for Companies Seeking Federal CHIPS Act Funds
The Center for Advanced Manufacturing at MassTech (CAM) has launched a new online portal that creates a single ‘digital front door’ for Massachusetts companies that are preparing proposals to the federal CHIPS Act, a major $50 billion dollar federal initiative designed to “strengthen and revitalize the U.S. position in semiconductor research, development, and manufacturing.”
