Packaging

Lattice Wins 2023 SEAL Sustainability Innovation Award

Lattice Semiconductor today announced that it was named a 2023 SEAL Sustainability Innovation Award winner.

Micron Scales Storage to New Heights With Launch of Two Data Center Drives

Micron Technology, Inc., (Nasdaq: MU), today announced the release of two SSDs, the Micron 6500 ION NVMe SSD and the Micron XTR NVMe SSD.

SMC Korea 2023 Opens Tomorrow With Future of Semiconductor Materials, Sustainability in Focus

Market forecasts, insights into the latest semiconductor materials developments, and the key role of materials in sustainability will take the spotlight at SMC (Strategic Materials Conference) Korea 2023 tomorrow at the Suwon Convention Center in Suwon-si, Gyeonggi-do, South Korea. 

Semiconductor Manufacturing Monitor Points to Moderating Industry Contraction in Q2 2023, SEMI Reports

The current global semiconductor manufacturing industry contraction is expected to moderate in the second quarter of 2023 and give way to a gradual recovery starting in the third quarter.

NXP and TSMC to Deliver Industry’s First Automotive 16nm FinFET Embedded MRAM

NXP Semiconductors today announced its collaboration with TSMC to deliver the industry’s first automotive embedded MRAM in 16nm FinFET technology.

GlobalFoundries, Samsung Electronics, and TSMC Join Imec’s “Sustainable Semiconductor Technologies & Systems” (SSTS) Program

In response to mounting concerns about climate change, tech companies around the world are accelerating the efforts to complete carbon neutrality for their supply chains and products.

Intel Surpasses First 2030 Goal: $2 Billion in Diverse Supplier Spending

Early success boosts Intel’s commitment to strengthening supplier diversity in the semiconductor ecosystem.

Littelfuse Appoints Dr. Greg Henderson to Board of Directors

Littelfuse, Inc. announced today the appointment of Dr. Greg Henderson to the company’s board of directors, effective May 15, 2023.

Advanced Semiconductor Packaging Technologies: The Development Trend and the Growth Drivers, IDTechEx Reports

Advanced semiconductor packaging technologies are crucial due to the slowing of Moore’s law and rising costs of monolithic Si IC development and manufacturing.

Samsung Develops Industry’s First CXL DRAM Supporting CXL 2.0

Samsung Electronics Co. Ltd. today announced its development of the industry’s first 128-gigabyte (GB) DRAM to support Compute Express Link (CXL) 2.0. Samsung worked closely with Intel on this landmark advancement on an Intel Xeon platform.

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