The 54,000-square-meter facility will be Entegris’ largest manufacturing facility producing solutions critical to chipmakers.
Packaging
IMAPS & IPC to Host On-Shoring Workshop July 10-12, 2023 in Washington, DC
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, July 10-12, 2023, in Washington, DC.
Silicon Catalyst Announces “Silicon Startups Contest” in Partnership with Arm
Worldwide call for applicants to qualify and win significant commercial and technical support from Arm.
Fujifilm to Acquire Semiconductor High Purity Process Chemicals Business from Entegris for $700 Million
FUJIFILM Corporation today announced that the company has entered into a definitive agreement to acquire the semiconductor high purity process chemicals (HPPC) business, CMC Materials KMG Corporation (KMG), from the US-based Entegris, Inc. for $700 million.
Save the Date: Gordon Moore Tribute, June 1
An event to commemorate the life, work and legacy of Intel’s co-founder is planned for June 1.
GlobalFoundries Announces Chief Financial Officer Transition and Names New Chief Business Officer
GlobalFoundries today announced the appointment of two new senior executives to its leadership team.
Mitsubishi Electric to Ship Samples of SBD-embedded SiC-MOSFET Module
Mitsubishi Electric Corporation announced today that it will begin shipping samples of a new Schottky barrier diode (SBD)-embedded silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) module.
ROHM Begins Mass Production of 650V GaN HEMTs that Deliver Class-Leading Performance
ROHM Semiconductor today announced mass production of 650V GaN (Gallium Nitride) HEMTs GNP1070TC-Z and GNP1150TCA-Z optimized for a wide range of power supply systems applications.
GlobalFoundries Announces New General Manager to Lead Malta Manufacturing Site
GlobalFoundries (Nasdaq: GFS) (GF) today announced the appointment of Hui Peng Koh as vice president and general manager of the company’s semiconductor manufacturing facility in Malta, New York.
InPlay Unveils World’s Smallest Bluetooth SoC in WLCSP Package
The new package, measuring an ultra-small 1.1mm x 2.0mm x 0.35mm, sets the record as the world’s smallest Bluetooth System on a Chip (SoC).
