Micron Technology, Inc. announced today that it is now delivering qualification samples of its Universal Flash Storage (UFS) 4.0 mobile solution, built on its advanced 232-layer 3D NAND.
Packaging
AMD Announces Plan to Invest $135 Million to Expand Adaptive Computing Research, Development and Engineering Operations in Ireland
AMD today announced plans for continued growth in Ireland through an investment of up to $135 million over four years.
Finwave Semiconductor Appoints Dr. Pierre-Yves Lesaicherre as New CEO
Finwave Semiconductor, Inc. today announced that Dr. Pierre-Yves Lesaicherre has joined the company as its chief executive officer.
Technical University of Denmark Installs New Takano Wafer Particle Measurement System from ClassOne Equipment
ClassOne Equipment announced the sale of its advanced new Takano WM-7SR particle measurement system to the DTU Nanolab at the Technical University of Denmark.
Lam Research Introduces World’s First Bevel Deposition Solution to Increase Yield in Chip Production
Lam Research Corp. today introduced Coronus DX, the industry’s first bevel deposition solution optimized to address key manufacturing challenges in next-generation logic, 3D NAND and advanced packaging applications.
Vitesco Technologies and ROHM Sign a Long-Term SiC Supply Partnership
Vitesco Technologies, an international manufacturer of modern drive technologies and electrification solutions, has secured strategically important capacities in energy-efficient silicon carbide power semiconductors through a long-term supply partnership with ROHM – worth over one billion US dollars until 2030.
Intel Plans Assembly and Test Facility in Poland
Investment near Wrocław, Poland, will help create a first-of-its-kind end-to-end leading-edge manufacturing semiconductor value chain in Europe.
Intel’s New Chip to Advance Silicon Spin Qubit Research for Quantum Computing
Intel makes new quantum chip available to university and federal research labs to grow the quantum computing research community.
Purdue University in Indianapolis: Launching Purdue’s First Comprehensive Urban Campus and Forming America’s Hard Tech Corridor
On June 14, 2023, Purdue University trustees and Indiana University trustees simultaneously approved the agreements that will effectively dissolve IUPUI on June 30, 2024, completing a process that started in August 2022.
Following All-Time Highs of 2022, Semiconductor Quartz Equipment Components Expected to be Down in 2023
TECHCET announced it expects a slight downturn in the Quartz components market, following an all-time high in 2022.
