In wireless communication, G stands for “generation” as in 4G, 5G, 6G. When it comes to data rate in optical communications though, “G” stands for gigabits per second (Gbps), and the progression doubles, as in 100G, 200G, 400G and 800G.
Packaging
Toshiba Digital Solutions and Classiq to Collaborate on Gate-based Quantum Computing
Toshiba Digital Solutions Corporation and Classiq Technologies Ltd. signed a technology collaboration agreement in the gate-based quantum computing.
Amkor Advanced Packaging Enables the Car of the Future
Amkor Technology, Inc., a provider of semiconductor packaging and test services and the #1 automotive OSAT, is innovating advanced packaging to enable the car of the future.
Introducing Lykos: Esmo Group’s BIB Loader/Unloader for the Semiconductor Industry
esmo group (esmo) announced the launch of its latest innovation, lykos, a modular Burn-in Board (BIB) loading and unloading system designed to eliminate manual placement and orientation errors.
Sivers Photonics Receives $1.3M Order from US Company for Custom Photonic Device Qualification
Sivers Semiconductors AB today announced that its subsidiary, Sivers Photonics, has received a new order worth $1.3M (approx. MSEK 14) for the qualification and supply of advanced photonic devices for optical sensing applications from a US-based customer.
Heraeus Electronics to Showcase Cutting-Edge Semiconductor Packaging Materials and Printed Electronics at SEMICON West
Heraeus Electronics announced its participation in SEMICON West, one of the most prominent global exhibitions for the semiconductor industry.
Highlight Tech Corp. (HTC) Announces Entry into US Market to Address Rapid Semiconductor Fab Growth
HTC, a Taiwan-based company and manufacturer of specialty process components, systems, and services for highly complex semiconductor manufacturing operations, today announced its expansion into the U.S. with the opening of a new North American headquarters, ‘HTC-America,’ strategically based in Phoenix.
Lockheed Martin and GlobalFoundries Collaborate to Advance Innovation and Resiliency of Chips for National Security
Collaboration will boost U.S. semiconductor supply chain for mission-critical security systems, in support of the CHIPS and Science Act.
Novel Ferroelectrics for More Efficient Microelectronics
A team of researchers from Carnegie Mellon University and Penn State University is exploring novel materials that have potential to make microelectronics more energy efficient.
Bosch Rexroth Announces Departure of President and CEO, Gregory Gumbs
Bosch Rexroth announced its President and Chief Executive Officer Gregory Gumbs will leave the company July 1, 2023.
