Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional flip-chip soldering.
Packaging
Micron Selects Nutanix Cloud Platform for Its Manufacturing Facilities Globally
Nutanix today announced that Micron Technology, an industry leader in innovative memory and storage solutions, selected Nutanix to build a cloud platform for Micron’s manufacturing facilities globally.
Archer’s Biochip gFET Design for Advanced Sensing Validated by Commercial Foundry Partner
Archer Materials’ commercial foundry partner in the Netherlands has validated its advanced biochip gFET design by manufacturing the chips using whole four-inch wafer semiconductor fabrication processes.
Vietnam Thriving Semiconductor Industry Fuels Economic Resilience Amidst Global Challenges
Vietnam’s semiconductor industry, bolstered by significant investments from industry giants like Samsung and Intel, and the relocation of major manufacturers from China, has partly helped the country shine amidst a global economic downturn.
Samsung Electro-Mechanics Begins Mass Production of the Industry’s First Thin-Film Coupled Power Inductor
On September 10, Samsung announced that it will commence mass production of coupled power inductors, which integrate two power inductors into a single chip.
Alchip Collaborates With Arteris To Expand ASIC Design Services
This collaboration can deliver highly optimized SoCs across various market segments.
ACM Research Introduces Vacuum Cleaning Platform Targeting the Rapidly Growing Chiplets Industry
The new tool, which was developed in collaboration with several key customers, has demonstrated excellent process performance with no flux residual remaining post-clean.
2024 Global Fab Equipment Spending Recovery Expected After 2023 Slowdown, SEMI Reports
Global fab equipment spending for front-end facilities in 2023 is expected to decline 15% year-over-year (YoY) to US$84 billion from a record high of US$99.5 billion in 2022 before rebounding 15% YoY to US$97 billion in 2024.
MediaTek Successfully Develops First Chip Using TSMC’s 3nm Process, Set for Volume Production in 2024
MediaTek and TSMC today announced that MediaTek has successfully developed its first chip using TSMC’s leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
Q2 2023 Global Semiconductor Equipment Billings Dip 2% Year-Over-Year, SEMI Reports
Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in the second quarter of 2023, while quarter-over-quarter billings slipped 4%, SEMI announced today.
