Analog Devices, Inc. today announced that its Board of Directors has appointed Stephen Jennings as an independent director and member of the Board’s Compensation and Talent Committee effective as of June 4, 2023.
Packaging
Microchip Slashes Time to Innovation with Industry’s Most Power-Efficient Mid-Range FPGA Industrial Edge Stack
Additions make it easier than ever to switch to PolarFire FPGAs and System-on-Chip (SoC) FPGAs.
Renesas Completes Acquisition of Panthronics
Renesas Electronics Corporation today announced its successful completion of acquiring Panthronics AG.
Pfeiffer Vacuum Plans to Invest €75M in its Annecy Location in France
Pfeiffer Vacuum Technology AG announced a seven-year, €75 million investment plan for its Annecy site at the “Choose France” summit for foreign investors.
ROHM’s New Class-Leading Low ON Resistance N-Channel MOSFETs
ROHM Semiconductor today announced the RS6xxxxBx / RH6xxxxBx series of N-channel MOSFETs (40V/60V/80V/100V/150V; 13 part numbers) suitable for applications operating on 24V/36V/48V power supplies, such as base stations, servers, and motors for industrial and consumer equipment.
CEA-Leti Proof of Concept Demonstrates Electrons Move Faster in Germanium Tin Than in Silicon or Germanium
CEA-Leti research scientists have demonstrated that electrons and other charge carriers can move faster in germanium tin than in silicon or germanium, enabling lower operation voltages and smaller footprints in vertical than in planar devices.
Semtech Announces New President and CEO
Semtech Corporation today announced that its board of directors has appointed Paul H. Pickle as Semtech’s new president and chief executive officer.
Nordson Test & Inspection Unveils New X-Ray Inspection System
Nordson Test & Inspection will unveil the new Quadra 7 Pro Manual X-Ray Inspection (MXI) system at SEMICON China.
ASM Breaks Ground on New Innovation and Manufacturing Center in Hwaseong, Korea
ASM International N.V. will take its symbolic first step in bringing its US$100 million multi-year investment in Hwaseong (Dongtan), South Korea, to fruition, with the groundbreaking ceremony tomorrow on its expanded innovation and manufacturing center.
Toshiba Releases Small Photorelay with High Speed Turn-On Time that Helps Shorten Test Time for Semiconductor Testers
Toshiba Electronic Devices & Storage Corporation has launched “TLP3476S,” a photorelay in the S-VSON4T package that cuts turn-on time to half that of Toshiba’s current product, TLP3475S. Volume shipments start today.
