Historically strong artificial intelligent chip shipments to North American customer accounted for much of the significant jump in first quarter revenue, according to President and CEO Johnny Shen.
Packaging
IEEE International Electron Devices Meeting (IEDM) Announces 2023 Call for Papers
Under the theme “Devices for a Smart World Built Upon 60 Years of CMOS,” the 69th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
Ayar Labs Adds $25 Million in Expansion of Its $130 Million Series C
Ayar Labs today announced it has raised an additional $25 million in Series C1 funding, bringing its total Series C raise to $155 million.
EV Group and Dymek Company Form Joint Venture Company in Malaysia
EV Group and Dymek Company today announced that they have established a new joint venture company in Malaysia.
SEMI North America Advisory Board Welcomes New Members From ASML and Breker Verification Systems
SEMI today announced the election of two new members to the SEMI North America Advisory Board (NAAB): Maheen Hamid, co-founder, CFO and COO of Breker Verification Systems, and Michael Lercel, Senior Director of Global Strategic Marketing at ASML.
Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027
Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022.
XlynX Crosslinker Enables Ultra-Stable Perovskite Solar Cells
The past decade has seen remarkable progress in the field of perovskite solar cells (PSCs), a next-generation technology that offers a lower cost and easier to manufacture alternative to conventional silicon solar cells.
SEMICON Southeast Asia 2023 Opens Tomorrow with Chip Industry Resilience and Growth in Focus
SEMICON Southeast Asia opens tomorrow with critical semiconductor industry topics including supply chain resilience, sustainability, Smart Manufacturing, Smart Mobility, Smart MedTech, and workforce development in focus.
Purdue Signs Landmark U.S.-Japan Agreement in Semiconductors at G7 Summit
On Sunday (May 21) in Hiroshima, Japan, Purdue President Mung Chiang signed another landmark international agreement, partnering with Micron, Tokyo Electron and other educational institutions in the United States and Japan to establish the “UPWARDS Network” for workforce advancement and research and development in semiconductors.
Applied Materials Launches Multibillion-Dollar R&D Platform
Applied Materials, Inc. today announced a landmark investment to build the world’s largest and most advanced facility for collaborative semiconductor process technology and manufacturing equipment research and development (R&D).
