Since it began in 1955, the IEEE International Electron Devices Meeting (IEDM) has been where the world’s best and brightest electronics technologists go to learn about the latest breakthroughs in semiconductor and related technologies.
Packaging
Terecircuits Unveils New Bonding Material for Next-Generation Advanced Packaging
Terecircuits Corporation, a venture-backed startup in advanced materials for the semiconductor industry, today introduced Terefilm, a patented material designed for temporary bonding and debonding applications in advanced packaging.
Northeast Microelectronics Coalition Hub Awards More Than $1 Million to Advance Microelectronic Innovation
First-of-its-kind program awards startups and small businesses with funding to develop next-gen microelectronics technologies.
Advanced Energy Announces STEM Scholarships for 2025-2026 Academic Year
Advanced Energy Industries, Inc. today announced the launch of its 2025 – 2026 Advanced Energy STEM Scholarship Program.
Sony Semiconductor Solutions to Release CMOS Image Sensor for Automotive Cameras
Sony Semiconductor Solutions Corporation (SSS) today announced the upcoming release of the ISX038 CMOS image sensor for automotive cameras, the industry’s first product that can simultaneously process and output RAW and YUV images.
Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
Amkor Technology, Inc. and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.
OMNIVISION Expands TheiaCel Product Portfolio with New 12MP-resolution Image Sensor
OMNIVISION today debuted its OX12A10 12-megapixel (MP)-resolution CMOS image sensor with TheiaCel technology at AutoSens Europe 2024.
RTX to Develop Ultra-Wide Bandgap Semiconductors for DARPA
New class of materials offer improved conductivity and thermal management properties.
Rapidus Establishes Back-End Semiconductor Manufacturing Process Research-and-Development Center
Rapidus Corporation, a company involved in the research, development, design, manufacture and sales of advanced logic semiconductors, today announced that it will set up a clean room within Seiko Epson Corporation’s facility in Chitose, Hokkaido, and open a research-and-development (R&D) center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS).
Jabil Acquires Mikros Technologies
Jabil Inc. today announced the successful acquisition of Mikros Technologies LLC, a leader in the engineering and manufacturing of liquid cooling solutions for thermal management, completed October 1.
