Samsung Electronics Co., Ltd. and AMD today announced they have signed a multi-year agreement extension to bring multiple generations of high-performance, ultra-low-power AMD Radeon graphics solutions to an expanded portfolio of Samsung Exynos SoCs.
Packaging
Wise-integration & Powernet Team Up to Deliver Digitally Controlled, Compact, Energy-Efficient GaN Power Supply Systems
Wise-integration, a French pioneer in digital control of gallium nitride (GaN) power supplies and GaN ICs, and Powernet, a Korean power supply manufacturer, today announced an agreement to build compact and energy-efficient technology for power-supply applications that are currently limited to analog control.
Archer Materials Advances to Wafer-Scale Quantum Device Fabrication
Hundreds of quantum electronic devices and qubit materials prepared for testing, measurement, integration, and optimisation towards qubit control and readout.
SJSemi Signed $340 Million of C+ Financing
SJ Semiconductor Corporation announced that it has signed $340 million of C+ financing with serial investors recently.
Axcelis Announces Shipment of 500th Purion Ion Implanter
The shipment went to a leading semiconductor device maker located in North America.
SEMIFIVE Achieves Mass Production Milestone of its SoC Platform
SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, announced it has begun mass production of its first SoC Platform-based AI chip product built on Samsung Foundry’s matured 14nm FinFET technology.
Kyocera to Acquire Construction Site in Japan for New Smart Factory
Kyocera Corporation today announced that it has reached an agreement to acquire about 37 acres of land for a new smart factory at the Minami Isahaya Industrial Park in Isahaya City, Nagasaki Prefecture.
FLEX Conference 2023 to Spotlight Latest Flexible Hybrid Electronics, Printed Electronics and Advanced Packaging Innovations
FLEX Conference will gather industry experts July 11-13, 2023, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible hybrid electronics (FHE), printed electronics and advanced packaging including heterogeneous integration.
Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon’s High-Performance Processors
VeriSilicon today announced Blue Ocean Smart System, an AI chiplet and SoC design company, has deployed high-performance AI chips with scalable chiplet architecture powered by multiple processors from VeriSilicon
Semiconductor Research Corporation announces 2023 Call for Research, $16.5M in Funding Opportunities
Semiconductor Research Corporation (SRC) is announcing the launch of solicitation season. Calls for research will begin in early April and will run through May.
