Demonstrating continued innovation, Kioxia Corporation and Western Digital Corp. today announced details of their newest 3D flash memory technology.
Packaging
JCET Accelerates Technology Upgrades and Transformation in 2022
JCET Group, a global provider of integrated circuit (IC) manufacturing and technology services, today announced its full year financial results for the year ended December 31, 2022.
Georgia Tech and GlobalFoundries to Collaborate on Joint Semiconductor Research and Workforce Development
New partnership to include educational opportunities for Georgia Tech students and faculty, STEM outreach, and joint R&D programs on GF technology.
Global Wafer Level Optics Market to Reach US$ 24,908M by 2031 at Staggering CAGR of 51.07%
Additionally, the market is also expected to see a growth in volume, with a CAGR of 50.68% during the same period.
Industrial-Grade Silicon Carbide MOSFET from Diodes Incorporated Enables Higher Power Density
Diodes Incorporated introduces the latest addition to its portfolio of Silicon Carbide (SiC) products: the DMWS120H100SM4 N-channel SiC MOSFET.
U.S. Secretary of Commerce Gina Raimondo Announces Fiber Manufacturing Expansions in North Carolina
Today, as part of the Biden-Harris Administration’s Investing in America tour, U.S. Secretary of Commerce Gina Raimondo and Assistant Secretary of Commerce for Communications and Information Alan Davidson traveled to Hickory, NC to celebrate the announcement of new fiber optic cable production in the U.S. made possible by the Administration’s Internet for All Initiative.
New Global Semiconductor Packaging Materials Outlook – US$26B Market to Approach US$30B by 2027
TECHCET and TechSearch International, Inc. recently announced that the market for Semiconductor Packaging Materials totaled US$26.1 billion in revenues for 2022, and is forecasted to approach US$30 billion in 2027.
New SIA Map Highlights Broad U.S. Semiconductor Ecosystem
The semiconductor ecosystem in the United States is broad and diverse, as illustrated by SIA’s new U.S. Semiconductor Ecosystem Map, a first-of-its-kind tool that allows users to explore industry activities across the country, including nearly 500 locations in 42 states.
New Chip Design to Provide Greatest Precision in Memory to Date
A team led by USC, MIT, and the University of Massachusetts, developed a protocol for devices to reduce “noise” and demonstrated the practicality of using this protocol in integrated chips.
ACM Research Receives First Purchase Order for Ultra C SiC Substrate Cleaning Tool
The platform leverages ACM’s patented Space Alternated Phase Shift (SAPS) cleaning technology which is designed to achieve more comprehensive cleaning without damage to device features.
