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Silicon Catalyst Announces “Silicon Startups Contest” in Partnership with Arm

Worldwide call for applicants to qualify and win significant commercial and technical support from Arm.

Fujifilm to Acquire Semiconductor High Purity Process Chemicals Business from Entegris for $700 Million

FUJIFILM Corporation today announced that the company has entered into a definitive agreement to acquire the semiconductor high purity process chemicals (HPPC) business, CMC Materials KMG Corporation (KMG), from the US-based Entegris, Inc. for $700 million.

Save the Date: Gordon Moore Tribute, June 1

An event to commemorate the life, work and legacy of Intel’s co-founder is planned for June 1.

GlobalFoundries Announces Chief Financial Officer Transition and Names New Chief Business Officer

GlobalFoundries today announced the appointment of two new senior executives to its leadership team.

Mitsubishi Electric to Ship Samples of SBD-embedded SiC-MOSFET Module

Mitsubishi Electric Corporation announced today that it will begin shipping samples of a new Schottky barrier diode (SBD)-embedded silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) module.

ROHM Begins Mass Production of 650V GaN HEMTs that Deliver Class-Leading Performance

ROHM Semiconductor today announced mass production of 650V GaN (Gallium Nitride) HEMTs GNP1070TC-Z and GNP1150TCA-Z optimized for a wide range of power supply systems applications.

GlobalFoundries Announces New General Manager to Lead Malta Manufacturing Site

GlobalFoundries (Nasdaq: GFS) (GF) today announced the appointment of Hui Peng Koh as vice president and general manager of the company’s semiconductor manufacturing facility in Malta, New York.

InPlay Unveils World’s Smallest Bluetooth SoC in WLCSP Package

The new package, measuring an ultra-small 1.1mm x 2.0mm x 0.35mm, sets the record as the world’s smallest Bluetooth System on a Chip (SoC).

Keysight Joins TSMC Open Innovation Platform 3DFabric Alliance

Keysight Technologies, Inc. (NYSE: KEYS) has joined the TSMC Open Innovation Platform (OIP) 3DFabric Alliance, which was formed recently by TSMC to accelerate 3D integrated circuit (IC) ecosystem innovation and readiness.

Robert Aslett Named Si2 President and CEO

Silicon Integration Initiative today announced that it appointed Robert Aslett as president and chief executive officer.

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