Intel Corporation today announced the appointment of Stuart Pann as senior vice president and general manager of Intel Foundry Services (IFS), Intel’s commercial foundry business.
Packaging
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
Commerce Department Outlines Proposed National Security Guardrails for CHIPS for America Incentives Program
Guardrails will ensure innovations and technology funded by CHIPS Act bolsters technological and national security for America and our allies.
Samsung Announces Ultra-Wideband Chipset with Centimeter-Level Accuracy for Mobile and Automotive Devices
Samsung Electronics Co., Ltd. today announced its first ultra-wideband (UWB) chipset, the Exynos Connect U100. With single-digit centimeter accuracy, the new UWB solution is optimized for use in mobile, automotive and Internet of Things (IoT) devices, offering precise distance and location information.
DNP Develops TGV Glass Core Substrate for Semiconductor Packages
Dai Nippon Printing Co., Ltd. has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages.
SEMICON West 2023 to Highlight Supply Chain Management, Sustainability and Workforce Development in Drive to $1 Trillion and Net Zero
Focusing on Building a Path Forward for the global semiconductor industry’s drive to $1 trillion and net zero, SEMICON West 2023 will gather industry experts and leaders July 11-13 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues.
SIA Commends Introduction of Bipartisan Legislation to Restore Immediate Deductibility of R&D Investments
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the introduction in Congress of bipartisan legislation to restore full tax deductibility of R&D investments.
Amtech Systems Receives Large Repeat Order for Advanced Packaging Reflow Systems
Amtech Systems, Inc. announced today a multi-unit order for high volume reflow systems used in advanced packaging applications.
Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices
Silicon Labs today announced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).
Henkel Delivers Versatile, High Thermal Die Attach Adhesive for Power IC Applications
Henkel today announced the availability of a die attach adhesive that provides high thermal capability to enable superior operation of power semiconductor packages.
