The Center for Advanced Manufacturing at MassTech Collaborative (CAM) and more than 85 organizations from across the Northeast have submitted a proposal to the federal government to create the Northeast Microelectronics Coalition.
Packaging
Finalists Selected for Round Six of Luminate NY
Empire State Development (ESD) announced the 10 companies selected to take part in round six of the Luminate NY accelerator program, investment fund, and competition.
IMAPS Advanced System-in-Package Conference is Now CHIPcon
The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023.
Micron Releases ‘We Are Micron’ 2022 Diversity, Equality and Inclusion Report
Initiatives creating readiness for the workforce of the future and highlighting ongoing commitment to diversity.
Electric Vehicle Components Market Is Estimated To Be Valued At US$ 1001.95 Billion By 2032
The market is further expected to gain size of USD 1001.95 Billion by the year 2032. The market is expected to grow with a CAGR of 21.05% in the forecast period.
Tower Semiconductor Announces World’s First Heterogeneous Integration of Quantum Dot Lasers on its Popular SiPho Foundry Platform PH18
Tower Semiconductor, a foundry of high-value analog semiconductor solutions, in collaboration with Quintessent, Inc, today announced the world’s first heterogeneous integration of GaAs quantum dot (QD) lasers and a foundry silicon photonics platform (PH18DB).
Tower Semiconductor and Teramount Announce Technology Collaboration Connecting a Large Number of Optical Fibers to Silicon Chips
Tower Semiconductor, a foundry of high value analog semiconductor solutions, and Teramount today announced a collaboration based on Teramount’s ‘PhotonicPlug’ technology and Tower’s silicon photonic ‘Bump-ready’ wafers.‘
POET Technologies and Vanguard Automation Collaborate on Solutions for Co-packaged Optics and AI-ML Applications
POET Technologies Inc. and Vanguard Automation GmbH today announced a collaboration to enable the integration of Micro-Lenses on the POET Optical Interposer to maximize coupling efficiency while maintaining POET’s wafer-level passive assembly process.
Sivers Semiconductors Joins the Northeastern Microelectronics Coalition
Sivers Wireless and more than 85 organizations from across the Northeast region of the United States have submitted a proposal to the US federal government to create the Northeast Microelectronics Coalition.
AmberSemi Announces Successful Tapeout of Silicon Chip for Patented AC Direct DC Power Delivery Technology
This technology represents a massive global opportunity to revolutionize the way power is delivered to every electrical endpoint on earth.
