More than 85 experts will offer insights on the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the 34th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2023), opening today in Saratoga Springs, New York.
Packaging
MIT Engineers “Grow” Atomically Thin Transistors On Top of Computer Chips
A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.
Student Competition Prepares Participants for Semiconductor Cybersecurity Workforce
Yesterday, competitors, organizers, and sponsors gathered in person for the first time in three years to celebrate the completion of MITRE’s 2023 Embedded Capture the Flag (eCTF) Competition.
Governor Hochul and Micron Announce Members of Community Engagement Committee to Advise on Nation-Leading Semiconductor Project
Governor Kathy Hochul and Micron Technology, Inc. today announced the members of the Micron Community Engagement Committee, including representatives from Central New York and Micron that will support the company’s community investment strategy.
U.S. CHIPS Program Office Awards TECHCET with Sole Source Contract for Critical Materials Supply Chain Info
TECHCET announced it has been awarded a contract from the National Institute of Standards and Technology (NIST)/ CHIPS Program Office (CPO) for materials supply chain data and analysis.
Gartner Forecasts Worldwide Semiconductor Revenue to Decline 11% in 2023
Global semiconductor revenue is projected to decline 11.2% in 2023, according to the latest forecast from Gartner, Inc. In 2022, the market totaled $599.6 billion, which was marginal growth of 0.2% from 2021.
New Pirani/Bayard-Alpert Vacuum Gauge from Pfeiffer Vacuum Ensures Process Control and Operational Reliability
Many vacuum applications operate only within a specific pressure range. In order to operate such vacuum systems efficiently, the total pressure must be measured reliably.
Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
Cadence Design Systems, Inc. today announced that the Cadence 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp.
onsemi Ships One Billionth Inductive Sensor IC to HELLA
onsemi today announced that the company has shipped its one billionth Inductive Sensor Interface Integrated Circuit (IC) to HELLA, an international automotive supplier operating under the umbrella brand FORVIA.
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
