The office in WestGate@Crane Technology Park will support Microelectronics R&D, strategic programs for the Defense Department and the Naval Surface Warfare Center, Crane Division.
Packaging
JEDEC Creates New Automotive Steering Subcommittee
JEDEC Solid State Technology Association announces the formation of the JC-42.9 Automotive Steering Subcommittee responsible for investigating memory technologies and recommending solutions pertaining to automotive applications.
SRC Publishes Interim Microelectronics and Advanced Packaging Technologies Roadmap, Seeks Public Comments
Semiconductor Research Corporation (SRC), a world-renowned semiconductor research and workforce development consortium, released an interim report for the Microelectronic and Advanced Packaging Technologies (MAPT) Roadmap.
StratEdge to Display Molded Ceramic Semiconductor Packages at the IMAPS Device Packaging, APEC, and GOMACTech Conferences
StratEdge Corporation will display its molded ceramic packages at the IMAPS Device Packaging, APEC, and GOMACTech conferences, all of which are being held in March.
Magnachip Unveils Super-Short Channel MXT MOSFETs for Smartphone Battery Protection Circuit Modules
Magnachip Semiconductor Corporation announced today that the company has released two seventh-generation MXT MOSFETs.
JCET Provides Multiple Customers with Advanced Packaging HVM Solutions for 4D Millimeter-wave Radar
JCET Group recently announced the company provides multiple customers with advanced packaging HVM solutions for 4D millimeter-wave Radar, to meet the increasingly diversified and customized demands of automotive electronic applications.
2023 CMC Conference Announces Lineup of Speakers
Featuring talks on current trends, issues, and new technologies for the semiconductor materials supply chain.
MITRE Engenuity and Semiconductor Alliance Position Paper Outlines Guidance for National Semiconductor Technology Center Incubation
Ensuring the United States improves its global competitiveness in semiconductors requires strategic deployment of the $52.7 billion in funding authorized in the CHIPS + Science Act.
Samsung, Micron, and SK Hynix Account for Three-Fourths of Leading-Edge Wafer Capacity
At the end of 2022, Samsung, Micron, and SK Hynix accounted for 76% of leading-edge capacity, with the vast majority of it for advanced DRAM and 3D NAND production.
ACM Research Receives Purchase Order for SAPS Tool from Major European Global Semiconductor Manufacturer
The tool is expected to be shipped to the prospective customer’s European facility in the fourth quarter of 2023.
