Intel Corporation today announced that it has agreed to sell an approximately 20% stake in its IMS Nanofabrication GmbH business to Bain Capital Special Situations, in a transaction that values IMS at approximately $4.3 billion.
Packaging
Biden-Harris Administration Outlines Plan to Strengthen Semiconductor Supply Chains as Part of Investing in America Agenda
Today, the U.S. Department of Commerce shared the Biden-Harris Administration’s strategic vision to strengthen the semiconductor supply chain through CHIPS for America investments.
Purdue, TSMC Extend Partnership on Semiconductor Research and Workforce Development
Semiconductor contract manufacturer stands as latest industry leader to join university’s global partnerships.
Micron Announces New Semiconductor Assembly and Test Facility in India
New DRAM and NAND assembly and test facility – the first in India – will expand Micron’s global manufacturing base to meet future demand.
Applied Materials to Establish Collaborative Engineering Center in India
Applied Materials, Inc. today announced its intention to build a collaborative engineering center in Bangalore, India focused on development and commercialization of technologies for semiconductor manufacturing equipment.
Micron UFS 4.0 Mobile Storage Built on 232-Layer 3D NAND Delivers Industry’s Fastest Performance for Smartphones
Micron Technology, Inc. announced today that it is now delivering qualification samples of its Universal Flash Storage (UFS) 4.0 mobile solution, built on its advanced 232-layer 3D NAND.
AMD Announces Plan to Invest $135 Million to Expand Adaptive Computing Research, Development and Engineering Operations in Ireland
AMD today announced plans for continued growth in Ireland through an investment of up to $135 million over four years.
Finwave Semiconductor Appoints Dr. Pierre-Yves Lesaicherre as New CEO
Finwave Semiconductor, Inc. today announced that Dr. Pierre-Yves Lesaicherre has joined the company as its chief executive officer.
Technical University of Denmark Installs New Takano Wafer Particle Measurement System from ClassOne Equipment
ClassOne Equipment announced the sale of its advanced new Takano WM-7SR particle measurement system to the DTU Nanolab at the Technical University of Denmark.
Lam Research Introduces World’s First Bevel Deposition Solution to Increase Yield in Chip Production
Lam Research Corp. today introduced Coronus DX, the industry’s first bevel deposition solution optimized to address key manufacturing challenges in next-generation logic, 3D NAND and advanced packaging applications.
