Accelerating the integration of heterogeneous dies to enable the next level of system scalability and functionality, Synopsys, Inc. has strengthened its collaboration with TSMC and Ansys for multi-die system design and manufacturing.
Packaging
Microchip Technology Announces Promotion of Rich Simoncic to Executive Vice President
Microchip Technology Inc., a provider of smart, connected and secure embedded control solutions, today announced that its board of directors has promoted Rich Simoncic to Executive Vice President of Microchip.
EMCORE Announces Restructuring Program
EMCORE Corporation today announced a restructuring program that includes the shutdown of the Broadband business segment and the discontinuance of its defense optoelectronics product line.
SEMI Europe Applauds Provisional Agreement Reached in EU Chips Act Trilogue Negotiations
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the provisional agreement reached yesterday in the European Chips Act Trilogue Negotiations to invest €43 billion to bolster Europe’s microelectronics industry.
Marvell Demonstrates Industry’s First 3nm Data Infrastructure Silicon
Marvell Technology, Inc. has demonstrated high-speed, ultra-high bandwidth silicon interconnects produced on Taiwan Semiconductor Manufacturing Company’s (TSMC) 3-nanometer (3nm) process.
SK hynix Develops Industry’s First 12-Layer HBM3
SK hynix Inc. announced today it has become the industry’s first to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity, currently the largest in the industry, and said customers’ performance evaluation of samples is underway.
SkyWater President and CEO Thomas Sonderman to Deliver Keynote at 2023 ASMC
Keynote to highlight impact of CHIPS Act on semiconductor manufacturing sector and importance of secure sources for critical emerging technology innovations.
Monozukuri Cracks the Code to IC/Package Co-optimization
Anna Fontanelli, Monozukuri S.p.A. CEO and Founder, demonstrated MZ-GENIO, the first integrated IC/Packaging EDA tool, during the “Advanced 3D architecture and design methodology” session at DATE on Wednesday in Antwerp, Belgium.
Take a Look Inside a Vacuum Gauge: Pfeiffer Vacuum Publishes Easy-to-Understand Videos
To assist in choosing the right measurement principle, Pfeiffer Vacuum has made helpful explanatory videos that give a detailed insight into the inner workings and functionality of vacuum gauges.
U.K.’s Space Forge Announces Plans to Launch U.S. Manufacturing Operations
U.K.-based Space Forge Ltd., which is pioneering space-based super materials manufacturing, announced today it is launching operations in the United States.
