Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Semiconductors
Biden-Harris Administration Announces CHIPS Incentives Award with SK hynix
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
NexWafe Hits Key Milestones in Solar Efficiency and Scalability
NexWafe GmbH (NexWafe) today announced significant breakthroughs in its solar wafer manufacturing technology.
NXP to Acquire Aviva Link
NXP Semiconductors N.V. announced today that it has entered into a definitive agreement to acquire Aviva Links, a provider of Automotive SerDes Alliance (ASA) compliant in-vehicle connectivity solutions in an all-cash transaction valued at $242.5 million.
EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure
Alliance membership enables EdgeCortix to collaborate with industry leaders and accelerate the adoption of power-efficient AI-RAN integrated systems.
Why Chiplet-Based Architecture Is the Next Frontier in Semiconductors
Traditional monolithic chip designs face mounting challenges as we continue to push the boundaries of computational power, energy efficiency, and cost-effectiveness. Enter chiplet-based architecture — an innovative solution poised to revolutionize semiconductor services and semiconductor solutions.
SignOff Semiconductors Unveils Expansion Plans Opening a New Office in Penang, Malaysia
SignOff Semiconductors Pvt. Ltd., headquartered in Bengaluru, India, and a provider of VLSI and Embedded Design services, announced the opening of its new office in Penang, Malaysia.
Advancing Light Control: New Opportunities for Metasurfaces in Optoelectronics
A global review of advancements in integrating metasurfaces – thin planar arrays of nanostructures – into optoelectronic devices highlights their potential to transform technologies such as Light Emitting Diodes (LEDs), lasers, optical modulators, and photodetectors.
HKU Engineering Researchers Develop Revolutionary Diamond Fabrication Technology
A research team led by Professor Zhiqin Chu, Associate Professor in the Department of Electrical & Electronic Engineering, and Professor Yuan Lin, Professor in the Department of Mechanical Engineering, Faculty of Engineering at the University of Hong Kong (HKU), has developed a groundbreaking method for massively producing ultrathin and ultra-flexible diamond membranes.
Micon Global and Silvaco Announce New Partnership
Micon Global announced a strategic sales partnership with Silvaco, a provider of software solutions for semiconductor and photonics design, including TCAD, EDA software, and SIP solutions.
