AI growth is capped by data transfer rates between computing chips, but transferring data with light could remove the ceiling.
Semiconductors
IEEE Electronic Components and Technology Conference Announces Best & Outstanding Papers from ECTC 2024
The IEEE Electronic Components and Technology Conference (ECTC), the world’s premier technical conference and product exhibition for the semiconductor packaging industry, has announced the winners of its prestigious Best and Outstanding Paper Awards for 2024.
Ruth Hernandez Appointed as Chief Sales Officer at Soitec
Soitec announces the appointment of Ruth Hernandez as Chief Sales Officer. She will join the Executive Committee with responsibility for driving Soitec’s commercial success.
Micross Acquires Integra Technologies
Micross Components, Inc., a provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today closed the acquisition of Integra Technologies.
Enabling HBM 16H Stacks with Residue-Free Fluxless Active Oxide Removal
Using a plasma-based approach, active oxide removal technology empowers 3D chiplet integration and the HBM devices with fine bump pitch roadmaps and new package architectures.
GF Piping Systems and Gradiant Partner Up to Drive Innovation for Sustainable Water Treatment
The collaboration aims to address the growing demands of the microelectronics and water industry, where precision, sustainability, and innovation are critical to success.
U.S. Department of Commerce Announces CHIPS Incentives Awards with Corning, Edwards Vacuum, and Infinera
Today, the U.S. Department of Commerce announced it finalized three separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Infinera’s Expansion Enhances Lehigh Valley’s Legacy of Technological Innovation
Infinera announced up to $93 million in federal funding to expand operations, including in the Lehigh Valley.
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
First of-its-kind center will offer advanced packaging and test capabilities in New York for U.S.-made essential chips used in AI, automotive, aerospace and defense, and other applications.
Department of Commerce Finalizes Long-Term Partnership with Natcast to Operate the National Semiconductor Technology Center
CHIPS for America award will support critical research and development to drive U.S. leadership in semiconductor innovation, economic growth, and national security.
