DELO has developed a new approach for fan-out wafer-level packaging (FOWLP).
Semiconductors
EV Group Announces Management Board Expansion In Light Of Unabated Growth
EV Group (EVG), a provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced the expansion of its management board.
Fractile Licenses Andes Technology’s RISC-V Vector Processor
Andes Technology, a supplier of high-efficiency, low-power 32/64-bit RISC-V processor cores and Founding Premier member of RISC-V International, announced a partnership with Fractile, the company building the chips and systems needed to reach the next frontier of AI performance.
Broadcom President & CEO Hock Tan to Receive Global Semiconductor Alliance’s Highest Honor
Global Semiconductor Alliance (GSA) announced it will honor Hock Tan, President and CEO of Broadcom, with its prestigious Dr. Morris Chang Exemplary Leadership Award at this year’s Annual Awards Celebration on Dec. 5, 2024.
GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile
Building on years of collaboration, this new process technology collaboration will provide power-efficient and secure connectivity solutions for essential consumer and industrial applications manufactured both in Europe and the U.S.
Nord Quantique Secures Semiconductor Supply Chain Through Two New Partnerships
Nord Quantique today announced two new partnerships to secure its supply chain long-term, as it relates to chip fabrication for its quantum computers.
U.S.-Canada Collaboration Grows with Bilateral Discussions Between C2MI and NY CREATES
The cross-border collaboration between Canadian and U.S. semiconductor-centered R&D, prototyping, and manufacturing industries continues to focus on ways to connect to expand opportunities as C2MI (MiQro Innovation Collaborative Centre), based in Bromont, Québec, Canada, and NY CREATES, based in Albany, NY, build upon their partnership that began in early 2024.
SPIE Photonics West 2025 Now Open for Registration
This year, the week will include 4,500-plus technical presentations across more than 100 technical conferences, as well as hosting over 1,200 companies in four focused exhibitions.
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
SEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.
Infinera’s Planned Expansion Enhances Lehigh Valley’s Legacy of Technological Innovation
Infinera announced it has tentatively agreed to receive up to $93 million in federal funding to expand operations, including in the Lehigh Valley.
