Purdue collaborates with Cadence, imec, SRC, Osaka University to bolster rapid technology development in U.S.
Semiconductors
Ardian Innovates with Pioneering Semiconductor Investment Platform
Ardian, a private investment house, today announces that it is expanding into semiconductor investment with the launch of Ardian Semiconductor.
The User Experience: More Intuitive X-Ray Inspection Software
A reimagined user interface saves technicians time.
GlobalFoundries Awarded $35 Million Funding from U.S. Government to Accelerate Manufacturing of Next-Generation GaN Chips
In partnership with U.S. Government, GF’s semiconductor manufacturing facility in Vermont continues to move closer to large-scale production of next-generation gallium nitride chips for use in aerospace and defense, cellular communications, industrial IoT and automobiles.
Intel’s Arizona Expansion Marks Construction Milestone
Intel continues its progress in construction and sustainability, strengthening its manufacturing legacy in Arizona.
Purdue Silicon Summit Further Accelerates Momentum with Announcements and Brings National, Global Semiconductor Leaders to Campus
Purdue University will host the 2023 Purdue Silicon Summit starting Oct. 17 and continuing through Oct. 25.
WGNSTAR Joins US Department of Defense Military Spouse Employment Partnership
WGNSTAR, a trusted partner for semiconductor manufacturers that offers managed workforce services and asset lifecycle management solutions, today announced it is joining the U.S. Department of Defense (DoD) Military Spouse Employment Partnership (MSEP).
Tribotronics: An Emerging Field by Coupling Triboelectricity and Semiconductors
Formed by the coupling effect of contact electrification and electrostatic induction, triboelectric nanogenerators (TENG) effectively convert the most widely distributed micro-nano energy in our environment, including human motion, breeze, vibration, and rainfall, into electrical energy, providing a sustainable solution to power a plethora of sensors that the current battery supply failed to address.
Ushering in the Era of Light-Powered ‘Multi-Level Memories’
The Korea Institute of Science and Technology (KIST) announced that has developed a new zero-dimensional and two-dimensional (2D-0D) semiconductor artificial junction material and observed the effect of a next-generation memory powered by light.
USPAE Announces Significant Response to DBX Microelectronics Challenge
The U.S. Partnership for Assured Electronics (USPAE) today announced that the Defense Business Accelerator (DBX) Microelectronics Challenge received twice the number of entries expected.
