Vishay Intertechnology, Inc. today announced that its Board of Directors has appointed David McConnell, Senior Vice President -Corporate Treasurer and Risk Management, to the role of Executive Vice President – Chief Financial Officer, replacing Lori Lipcaman who is resigning from that position.
Semiconductors
eBeam Initiative Marks 15-Year Anniversary
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today marks its 15-year anniversary at an annual meeting being held in conjunction with the SPIE Advanced Lithography + Patterning Conference in San Jose.
Accellera Systems Initiative Honors Shalom Bresticker with First Distinguished Service Award
Accellera Systems Initiative (Accellera) announced today that Shalom Bresticker, a longtime friend and contributor to Accellera standards efforts, is honored with the first Distinguished Service Award.
Scintil Achieves Integration of III-V DFB Lasers and Amplifiers with Standard Silicon Photonics Technology in Production at Tower Semiconductor
This significant milestone is pivotal in reinforcing Scintil’s supply chain and meeting growing demand for high-performance communication solutions in data centers, artificial intelligence (AI) and 5G networks.
Imec Demonstrates Readiness of the High-NA EUV Patterning Ecosystem
Advances in processes, masks and metrology will enable to fully benefit from the resolution gain offered by the first ASML 0.55NA EUV scanner.
Finwave Semiconductor Showcases Breakthrough Performance Advancement with GaN-on-Silicon Technology at MWC Barcelona 2024
Finwave Semiconductor, Inc. is showcasing its latest technology and products this week at MWC Barcelona.
National Institute for Innovation and Technology Hosts Arizona Semiconductor Panel Discussion
Institute’s panel brought together key stakeholders for panel discussion on workforce development in growing semiconductor manufacturing industry, highlights the City of Phoenix’s efforts.
SAPEON Collaborates with DOCOMO Innovations
SAPEON, a global AI semiconductor company, announced their partnership with DOCOMO Innovations, INC. based in Silicon Valley, a subsidiary of Japan’s largest mobile operator, NTT DOCOMO, INC.
Micron Commences Volume Production of Industry-Leading HBM3E Solution to Accelerate the Growth of AI
Micron Technology, Inc. today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution.
U.S. Department of Energy Announces $2.25 Million American-Made SiC Semiconductor Prize Competition
The U.S. Department of Energy’s (DOE) Office of Electricity (OE) today launched the American-Made Silicon Carbide (SiC) Semiconductor Packaging Prize.
