Semiconductors

Advantest Expands M4841 Handler with Active Thermal Control for Faster Device Throughput and Test Times

Semiconductor test equipment supplier Advantest Corporation today announced a new Active Thermal Control (ATC) option for its M4841 high-volume device handler.

onsemi Completes Expansion of Silicon Carbide Production Facility in Bucheon, South Korea

At full capacity, the Bucheon fab will be able to manufacture more than one million SiC wafers annually.

Element Six Selected for U.S Department of Defense LADDIS Program

LADDIS aims to develop new ways of fabricating device-quality diamond substrates with ultimate applications that include radio-frequency and power electronics to operate in the harsh environments of military applications.

Gartner Forecasts Worldwide IT Spending to Grow 8% in 2024

Worldwide IT spending is projected to total $5.1 trillion in 2024, an increase of 8% from 2023, according to the latest forecast by Gartner, Inc.

Ansys Receives Four TSMC 2023 OIP Partner of the Year Awards for Joint Development of Leading Multiphysics Technology and Design Solutions

Ansys has been recognized by TSMC as a recipient of four TSMC Open Innovation Platform (OIP) Partner of the year awards for 2023.

NexPoint Launches NexPoint Semiconductor Manufacturing DST Offering

NexPoint, an alternative investment firm with $14.4 billion in assets under management, today announced the launch of NexPoint Semiconductor Manufacturing DST.

ventureLAB and Intel Sign Formal Collaboration for 2024

ventureLAB’s President and CEO, Hugh Chow, welcomed Denis Gaudreault, Country Manager at Intel Canada, global leader in design and manufacturing of essential technologies in the smart world, to its space.

Micron Low-Power Memory Solution Boosts Mixed and Virtual Reality Experiences on Snapdragon XR2 Gen 2

Micron Technology, Inc. announced today that its low-power double data rate 5X (LPDDR5X) DRAM and Universal Flash Storage (UFS) 3.1 embedded solutions are now qualified on Qualcomm Technologies’ latest extended reality (XR) platform, Snapdragon XR2 Gen 2 Platform.

New Institute Accelerates Future of Microelectronic System Integration, Advanced Packaging

Purdue collaborates with Cadence, imec, SRC, Osaka University to bolster rapid technology development in U.S.

Ardian Innovates with Pioneering Semiconductor Investment Platform

Ardian, a private investment house, today announces that it is expanding into semiconductor investment with the launch of Ardian Semiconductor.

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