Leveraging hybrid bonding as an alternative to dimensional scaling.
Semiconductors
Penn State and onsemi Sign MOU to Boost Silicon Carbide Research in the United States
onsemi and Penn State announced the signing of a memorandum of understanding (MOU) towards an $8 million strategic collaboration which includes the establishment of the onsemi Silicon Carbide Crystal Center (SiC3) at Penn State’s Materials Research Institute (MRI). onsemi will fund SiC3 with $800k per year over the next 10 years.
Massachusetts Launches Portal for Companies Seeking Federal CHIPS Act Funds
The Center for Advanced Manufacturing at MassTech (CAM) has launched a new online portal that creates a single ‘digital front door’ for Massachusetts companies that are preparing proposals to the federal CHIPS Act, a major $50 billion dollar federal initiative designed to “strengthen and revitalize the U.S. position in semiconductor research, development, and manufacturing.”
Colliers Joins Silicon Catalyst Ecosystem as an In-Kind Partner
The Silicon Valley office of Colliers announced today that it has joined Silicon Catalyst, the world’s only incubator focused on accelerating semiconductor solutions, as an In-Kind Partner.
Micron to Bring EUV Technology to Japan, Advancing Next-Generation Memory Manufacturing
Micron Technology, Inc. announced today it will be introducing extreme ultraviolet (EUV) technology to Japan, tapping this sophisticated patterning technology to manufacture its next generation of DRAM, the 1-gamma (1γ) node.
Micron Scales Storage to New Heights With Launch of Two Data Center Drives
Micron Technology, Inc., (Nasdaq: MU), today announced the release of two SSDs, the Micron 6500 ION NVMe SSD and the Micron XTR NVMe SSD.
SMC Korea 2023 Opens Tomorrow With Future of Semiconductor Materials, Sustainability in Focus
Market forecasts, insights into the latest semiconductor materials developments, and the key role of materials in sustainability will take the spotlight at SMC (Strategic Materials Conference) Korea 2023 tomorrow at the Suwon Convention Center in Suwon-si, Gyeonggi-do, South Korea.
Final Call: Applications for the 2nd Tech Innovation Excellence Award (TIE Award)
The deadline for applications for the 2nd Tech Innovation Excellence Award (TIE Award) is approaching.
NXP and TSMC to Deliver Industry’s First Automotive 16nm FinFET Embedded MRAM
NXP Semiconductors today announced its collaboration with TSMC to deliver the industry’s first automotive embedded MRAM in 16nm FinFET technology.
