Amkor Technology, Inc. and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.
Semiconductors
RTX to Develop Ultra-Wide Bandgap Semiconductors for DARPA
New class of materials offer improved conductivity and thermal management properties.
Rapidus Establishes Back-End Semiconductor Manufacturing Process Research-and-Development Center
Rapidus Corporation, a company involved in the research, development, design, manufacture and sales of advanced logic semiconductors, today announced that it will set up a clean room within Seiko Epson Corporation’s facility in Chitose, Hokkaido, and open a research-and-development (R&D) center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS).
Leveraging Visual Data Science in the Semiconductor Manufacturing Industry
“Data, data everywhere.. what am I to think?” This riff on the Rime of the Ancient Mariner may well be the lament of every engineer in the semiconductor industry who feels as if they are drowning in data. Fortunately, new tools are now available that can help.
ZEISS Microscopy Opens Semiconductor Applications Laboratory in Dresden
ZEISS has announced it recently opened the ZEISS Microscopy semiconductor applications lab in Dresden.
Hurricane Helene Could Have a Significant Impact on High Purity Quartz, Semiconductor Supply
A tropical storm, remnants of Hurricane Helene, ripped through the western North Carolina mountain town of Spruce Pine last week, disrupting quartz supply operations at both Sibelco and The Quartz Corp.
DENSO and ROHM Agree to Start Consideration of Strategic Partnership in the Semiconductor Field
DENSO CORPORATION and ROHM Co., Ltd. announced that the two companies have agreed to start consideration of strategic partnership in the semiconductor field.
eBeam Initiative Survey of Semiconductor Luminaries Predicts Photomask Market Growth and Increasing Investments in Mask Inspection and Multi-beam Mask Writing
Results of 13th annual Luminaries survey to be presented at live event held during SPIE Photomask Technology + EUV Lithography Conference.
Georgia Tech to Use ClassOne Technology Solstice S8 Single-Wafer Wet Processing System for Advanced Packaging R&D
ClassOne to support establishment of 3D heterogeneous integration hub at Georgia Tech’s Institute for Matter and Systems
ASM Launches PE2O8 Silicon Carbide Epitaxy System
Today at the 2024 International Conference on Silicon Carbide and Related Materials, ASM International N.V. (Euronext Amsterdam: ASM) introduced the PE2O8 silicon carbide epitaxy system, a new, dual chamber, platform for silicon carbide (SiC) epitaxy (Epi).
