Over the past years, global PC and laptop ownership and usage have significantly decreased, mainly replaced by smartphones.
Semiconductors
Synopsys, TSMC and Ansys Strengthen Ecosystem Collaboration to Advance Multi-Die Systems
Accelerating the integration of heterogeneous dies to enable the next level of system scalability and functionality, Synopsys, Inc. has strengthened its collaboration with TSMC and Ansys for multi-die system design and manufacturing.
EMCORE Announces Restructuring Program
EMCORE Corporation today announced a restructuring program that includes the shutdown of the Broadband business segment and the discontinuance of its defense optoelectronics product line.
TSMC Facing Cyclical Headwinds, But its Long-Term Outlook Looks Bright, Says GlobalData
Following the news that TSMC reported solid Q1 2023 results; Josep Bori, Thematic Research Director at GlobalData, offered his view.
NXP Semiconductors Names New Senior Fellows
Industry experts recognized for exceptional achievements in innovation.
SEMI Europe Applauds Provisional Agreement Reached in EU Chips Act Trilogue Negotiations
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the provisional agreement reached yesterday in the European Chips Act Trilogue Negotiations to invest €43 billion to bolster Europe’s microelectronics industry.
ROHM Introduces the Industry’s Smallest Class of Short-Wavelength Infrared Devices
ROHM Semiconductor today announced mass production technology for Short-Wavelength Infrared (SWIR) devices in the industry’s smallest class 1608-size (1.6mm × >0.8mm) for portable / wearable / hearable devices requiring material detection.
Creation of Thinnest Freestanding Film With Ferroelectric Properties Ever Opens the Door to Smaller, More Efficient Devices
Researchers at the Institute for Future Materials and Systems at Nagoya University in Japan have successfully synthesized barium titanate (BaTiO3) nanosheets with a thickness of 1.8 nanometers, the thinnest thickness ever created for a free-standing film.
Marvell Demonstrates Industry’s First 3nm Data Infrastructure Silicon
Marvell Technology, Inc. has demonstrated high-speed, ultra-high bandwidth silicon interconnects produced on Taiwan Semiconductor Manufacturing Company’s (TSMC) 3-nanometer (3nm) process.
SK hynix Develops Industry’s First 12-Layer HBM3
SK hynix Inc. announced today it has become the industry’s first to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity, currently the largest in the industry, and said customers’ performance evaluation of samples is underway.
