Fractilia Overlay Package offered as an optional feature for Fractilia’s MetroLER and FAME products, which have been adopted by dozens of industry-leading companies
Semiconductors
Introducing Lykos: Esmo Group’s BIB Loader/Unloader for the Semiconductor Industry
esmo group (esmo) announced the launch of its latest innovation, lykos, a modular Burn-in Board (BIB) loading and unloading system designed to eliminate manual placement and orientation errors.
Sivers Photonics Receives $1.3M Order from US Company for Custom Photonic Device Qualification
Sivers Semiconductors AB today announced that its subsidiary, Sivers Photonics, has received a new order worth $1.3M (approx. MSEK 14) for the qualification and supply of advanced photonic devices for optical sensing applications from a US-based customer.
Ambiq Achieves Milestone of Powering Over 200 Million IoT Devices
Ambiq, a developer of ultra-low-power semiconductor solutions that deliver a multifold increase in energy efficiency, achieved a key milestone of powering over 200 million IOT devices earlier this year.
Micron, STEMM Opportunity Alliance and National Science Foundation Advance New Workforce Development Collaborations
Northwest University Semiconductor Network reinforces nationwide commitment to building semiconductor workforce of the future.
Highlight Tech Corp. (HTC) Announces Entry into US Market to Address Rapid Semiconductor Fab Growth
HTC, a Taiwan-based company and manufacturer of specialty process components, systems, and services for highly complex semiconductor manufacturing operations, today announced its expansion into the U.S. with the opening of a new North American headquarters, ‘HTC-America,’ strategically based in Phoenix.
Lockheed Martin and GlobalFoundries Collaborate to Advance Innovation and Resiliency of Chips for National Security
Collaboration will boost U.S. semiconductor supply chain for mission-critical security systems, in support of the CHIPS and Science Act.
Dr. Terry Nisbet Joins Newly Formed Technical Advisory Committee
MACOM Technology Solutions Inc., a supplier of semiconductor products, today announced that Dr. Terry Nisbet will join MACOM’s newly established Technical Advisory Committee.
Novel Ferroelectrics for More Efficient Microelectronics
A team of researchers from Carnegie Mellon University and Penn State University is exploring novel materials that have potential to make microelectronics more energy efficient.
Bosch Rexroth Announces Departure of President and CEO, Gregory Gumbs
Bosch Rexroth announced its President and Chief Executive Officer Gregory Gumbs will leave the company July 1, 2023.
