Embracing automation will have several benefits for the industry, not the least of which is enabling scalable production solutions that meet the evolving needs of customers during their business cycles.
Semiconductors
2025: Sustainability and Photonics
For managing the energy needed for data processing, a key future technology will be silicon photonics, which enables seamless integration of optical components like waveguides, switches, and modulators with electronic circuits on a single silicon chip.
2025: AI, Networking/Communications, Personal Mobility and Aerospace-Defense to Drive Changes
As the heartbeat of intelligent, connected electronics, precision timing will play a key role in 2025’s expansion. Precision timing will drive innovation across industries like healthcare, manufacturing, FinTech, and cybersecurity.
2025: MEMS Move to 300mm
The move to 300mm wafers as a substantial leap forward for the MEMS industry in manufacturing automation and cost-effectiveness, yet many challenges remain.
2025: Photonic Integrated Circuits – Driving Quantum Technology
Innovations around photonic integrated circuits (PICs) have the potential to transform our ability to meet the demands of our increasingly data-driven world.
2025: Optimizing Automated Test Equipment for the Era of AI and Beyond
The role of advanced ATE systems will become even more critical; smaller geometries increase test sensitivity requirements, demanding ATE systems with higher precision and accuracy.
2025: Advancements in Litho Technologies Enabling Next-Generation Multi-Chip Systems
As advanced packing gains momentum, the industry will be looking to novel, creative processing solutions to handle the integration imperatives of today – and tomorrow.
2025: The Future is Bright for the Photomask Industry
Increasing investments in critical photomask infrastructure yields benefits for the entire mask-to-wafer ecosystem.
2025: AI is the Driving Force
This year continues to anticipate the impact of AI as the driving force behind optimism in our industry.
2025: New Packaging Approaches Drive Cost and Efficiency
The fast adoption of chiplets will continue to drive wafer-level packaging (WLP) growth in 2025, as semiconductor companies continue to invest in various types of packages for diverse applications.
