Historically strong artificial intelligent chip shipments to North American customer accounted for much of the significant jump in first quarter revenue, according to President and CEO Johnny Shen.
Semiconductors
IEEE International Electron Devices Meeting (IEDM) Announces 2023 Call for Papers
Under the theme “Devices for a Smart World Built Upon 60 Years of CMOS,” the 69th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
Breakthrough in Computer Chip Energy Efficiency Could Cut Data Center Electricity Use
Researchers at Oregon State University and Baylor University have made a breakthrough toward reducing the energy consumption of the photonic chips used in data centers and supercomputers.
Ayar Labs Adds $25 Million in Expansion of Its $130 Million Series C
Ayar Labs today announced it has raised an additional $25 million in Series C1 funding, bringing its total Series C raise to $155 million.
Semiconductor Chemical Revenues Fall as Energy Prices Rise
Wet chemical market decline follows wafer start slowdown.
EV Group and Dymek Company Form Joint Venture Company in Malaysia
EV Group and Dymek Company today announced that they have established a new joint venture company in Malaysia.
SEMI North America Advisory Board Welcomes New Members From ASML and Breker Verification Systems
SEMI today announced the election of two new members to the SEMI North America Advisory Board (NAAB): Maheen Hamid, co-founder, CFO and COO of Breker Verification Systems, and Michael Lercel, Senior Director of Global Strategic Marketing at ASML.
Applied Materials Convenes Leaders from Industry, Academia and Government at “Summit to Advance Semiconductor Leadership”
Applied Materials, Inc. today hosted the Summit to Advance Semiconductor Leadership – an event focused on exploring solutions for overcoming key challenges facing the semiconductor industry on its path to becoming a $1 trillion market over the next decade.
Imec First to Demonstrate Conductor Films on 300mm Wafers with Lower Resistivity than Cu and Ru
This week, at the 2023 IEEE International Interconnect Technology Conference (2023 IEEE IITC), imec provides the first experimental evidence that the resistivity of a thin conductor film on a 300mm Si wafer can be lower than that of Cu and Ru, which are currently used in interconnect metallization schemes.
SEMICON Southeast Asia 2023 Opens Tomorrow with Chip Industry Resilience and Growth in Focus
SEMICON Southeast Asia opens tomorrow with critical semiconductor industry topics including supply chain resilience, sustainability, Smart Manufacturing, Smart Mobility, Smart MedTech, and workforce development in focus.
