Traditional monolithic chip designs face mounting challenges as we continue to push the boundaries of computational power, energy efficiency, and cost-effectiveness. Enter chiplet-based architecture — an innovative solution poised to revolutionize semiconductor services and semiconductor solutions.
Semiconductors
SignOff Semiconductors Unveils Expansion Plans Opening a New Office in Penang, Malaysia
SignOff Semiconductors Pvt. Ltd., headquartered in Bengaluru, India, and a provider of VLSI and Embedded Design services, announced the opening of its new office in Penang, Malaysia.
Advancing Light Control: New Opportunities for Metasurfaces in Optoelectronics
A global review of advancements in integrating metasurfaces – thin planar arrays of nanostructures – into optoelectronic devices highlights their potential to transform technologies such as Light Emitting Diodes (LEDs), lasers, optical modulators, and photodetectors.
HKU Engineering Researchers Develop Revolutionary Diamond Fabrication Technology
A research team led by Professor Zhiqin Chu, Associate Professor in the Department of Electrical & Electronic Engineering, and Professor Yuan Lin, Professor in the Department of Mechanical Engineering, Faculty of Engineering at the University of Hong Kong (HKU), has developed a groundbreaking method for massively producing ultrathin and ultra-flexible diamond membranes.
Micon Global and Silvaco Announce New Partnership
Micon Global announced a strategic sales partnership with Silvaco, a provider of software solutions for semiconductor and photonics design, including TCAD, EDA software, and SIP solutions.
Solving the Skilled Tech Talent Gap in the Semiconductor Industry
By implementing strategic workforce management and partnering with experienced experts, semiconductor companies can effectively navigate the talent shortage, build a sustainable workforce, and position themselves for long-term success
Maximizing the Value of Wastewater Generated During Semiconductor Fabrication
The semiconductor aims to reduce pollutants and freshwater consumption, reuse water, and recycle resources.
Biden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers
The Biden-Harris Administration announced that the U.S. Department of Commerce issued direct funding awards to GlobalWafers America, LLC (GWA) and MEMC LLC (MEMC), subsidiaries of GlobalWafers Co.
Rapidus Begins Installation of Japan’s First EUV Lithography Machinery
This is a significant milestone for Japan’s semiconductor industry, marking the first time that an EUV lithography tool will be used for mass production in the country.
PlayNitride Selects Veeco’s Lumina MOCVD System for MicroLED Production
Veeco Instruments Inc. today announced that PlayNitride has qualified Veeco’s Lumina MOCVD system for production of next-generation MicroLEDs, and also placed an order for two systems for delivery in 2025.
