The transaction is expected to close in the first quarter of 2023, subject to receipt of required regulatory approvals and other customary closing conditions.
Semiconductors
Scientists Enable Thinnest Quantum Light Source by New 2D Layered Materials
Recent advances in SPDC-based quantum light sources based on two-dimensional layered materials have been made by a team led by Prof. REN Xifeng from the University of Science and Technology of China (USTC), collaborating with Prof. QIU Chengwei and Dr. GUO Qiangbing from the National University of Singapore (NUS).
SEMI Announces Election of Mary Puma, Axcelis Technologies CEO, as International Board Chair
SEMI today announced that its International Board of Directors has elected Mary Puma, president and CEO of Axcelis Technologies, as its new chairperson, effective immediately, in accordance with the association’s by-laws.
Foundry Revenue Is Forecasted to Drop by 4% YoY for 2023
TrendForce’s recent analysis of the foundry market reveals that demand continues to slide for all types of mature and advanced nodes.
Quantum Simulator Enables First Microscopic Observation of Charge Carriers Pairing
A team of researchers at the Max Planck Institute of Quantum Optics has for the first time monitored in an experiment how holes (positive charge carriers) in a solid-state model combined to form pairs. This process could play an important role in understanding high-temperature superconductivity.
Akoustis Receives First High-Volume 5G Mobile XBAW Filter Order from Tier-1 RF Component Company
The filter solution leverages one of Akoustis’ new wafer-level-packages (WLP), developed and manufactured in its Canandaigua, New York fab.
Melexis to Invest 70M EUR in Facility Expansion in Kuching, Malaysia
Melexis, a global supplier of micro-electronic semiconductor solutions, is expanding its facility in Kuching, Malaysia.
New All-in-One Hybrid Power Drive Module Solution from Microchip
The highly integrated and configurable three-phase power module is the first variant of the new family and can be customized using silicon carbide or silicon, reducing power solution size and weight for electric aircraft.
What’s New in the 2022 IEEE IP-XACT Standard? Big Reveals from the Chair
Does semiconductor IP still matter? And what does the chair of the IEEE-1685 IP-XACT standard reveal about the latest feature sets?
Gel-Pak Brings Latest Innovations to Photonics West
Gel-Pak, a Delphon company and a worldwide leader in cutting-edge materials and protective carriers for photonic devices, today announced it will demonstrate its latest material breakthroughs for the photonics market at Photonics West.
