ROHM Co., Ltd. today announced that they have entered into a strategic partnership with TSMC on the development and volume production of gallium nitride (GaN) power devices for electric vehicle applications.
Semiconductors
ACM Research Strengthens Atomic Layer Deposition Portfolio with Qualification of Thermal and Plasma-Enhanced ALD Furnace Tools
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the qualification of its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition (PEALD) Furnace tool.
Global Trade Restrictions on Semiconductor Materials Intensify: TECHCET Offers Critical Market Insights
In a series of escalating trade measures, China announced on December 3, 2024, a complete export ban to the U.S. on rare earth materials, including gallium, germanium, antimony, and superhard materials.
CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
CEA-Leti research engineers have demonstrated for the first time a scalable hafnia-zirconia-based ferroelectric capacitor platform integrated into the back-end-of-line (BEOL) at the 22nm FD-SOI technology node.
SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects
The Semiconductor Industry Association applauded the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia.
Lam Research Introduces the Semiconductor Industry’s First Collaborative Robot for Fab Maintenance Optimization
Dextro’s robotic arm delivers precision and accuracy to help chipmakers drive yield improvement.
Tackling Network-on-Chip (NoC) Scaling Challenges with a System-technology Co-optimization Approach
Co-integration of NoC routing channels alongside the backside power delivery network: a scalable and cost-effective approach.
Advantest Launches KGD Test Cell for Power Semiconductors
Semiconductor test equipment supplier Advantest Corporation today announced an integrated test cell designed to maximize die-level test yields for wide-bandgap (WBG) devices essential to power semiconductors.
Researchers Design New Materials for Advanced Chip Manufacturing
Three University of Texas at Dallas faculty members and collaborators from other universities and two industry partners have teamed up to design and test indium-based materials to enable the manufacture of the next generation of computer chips.
NY CREATES and JETRO Announce Strategic Partnership to Strengthen U.S.-Japan Collaboration in the Semiconductor Industry
NY CREATES and the Japan External Trade Organization (JETRO) today announced a strategic partnership to drive international collaboration in the semiconductor industry, highlighting a commitment to promoting advanced chips-related research and development, technology alliances, and workforce development across the high-tech ecosystems of New York’s Capital Region and Japan.
